Thermal Interface Pads

Henkel IconThermal Management is becoming an increasingly important part of application design. Luckily Henkels’ Bergquist offers TIMs(Thermal Interface Materials) to allow for management of thermal issues. NEDC Sealing Solutions converts Henkel’s Bergquist Thermal Materials into finished parts. These finished parts are commonly known as thermal pads.

Gap Pad®

thermal gap pads

Gap Pad® is a gap filler used between electronics and heat sinks as a thermal interface. The benefit of Gap Pad is that it may conform to the different surfaces and textures that may be present in electronic applications. Gap Pad may be used to fill air gaps, inconsistent surface topography, and other odd surfaces. The benefits it provides are:

  • Low-stress vibration dampening
  • Elimination of air gaps to reduce thermal resistance
  • High conformability to reduce interfacial resistance

There are a significant amount of Gap Pad® offerings for different applications. This allows for a good mix of performance, price point, and assembly use.

  • Gap Pad® VO Ultra Soft (VOUS)
  • Gap Pad® VO Soft (VOS)
  • Gap Pad® 1500S30
  • Gap Pad® 1500
  • Gap Pad® 2000S40
  • Gap Pad® 5000S35
  • Gap Pad® 2200SF
  • Gap Pad® 7000ULM
  • Gap Pad® 3500ULM

As well as offering a significant amount of varieties of Gap Pad®, Henkel also offers most of them in a wide range of thicknesses. Some Gap Pads are available with PSA (Pressure Sensitive Adhesive) as well. NEDC offers die-cutting (converting) services with all of these different types of Gap Pads. For more information on Gap Pad®, please visit Henkels’ website.

Sil Pad®

Sil Pad® is a thermally conductive insulator that has a wide reaching use in different applications. The benefits of Sil Pad® include:

  • Excellent thermal performance
  • Eliminates the trouble from grease
  • More durable than mica
  • It has an efficient cost structure

Sil Pad® has a long list of varieties, all of these different types of Sil Pad® have different qualities and benefits.

  • Sil Pad® 400
  • Sil Pad® 800
  • Sil Pad® 980
  • Sil Pad® A1500
  • Sil Pad® 1200
  • Sil Pad® 2000
  • Sil Pad® A2000

While offering a long list of different types of Sil Pad® Products, Henkel also offers some of these thermally conductive materials with PSA (Pressure Sensitive Adhesive.) NEDC offers die-cutting (converting) services for Henkel materials, including Sil Pad®. For more information on Sil Pad® please visit Henkels’ website.

Hi-Flow®

Hi-Flow is a thermally conductive material that serves as a phase change material. Hi-Flow is useful in applications requiring a replacement for grease as a thermal interface between CPU or power devices and a heat sink. The benefits of Hi-Flow material include:

  • A replacement to grease, with the benefit of saving time and money
  • Easy handling, not tacky at room temperature
  • Simplified application process with many tabbed configurations

While Henkel Company puts out a significant amount of different Hi-Flows, it’s important to name a few:

  • Hi-Flow 105
  • Hi-Flow 225F-AC
  • Hi Flow-225U
  • Hi-Flow 650P

As well as having a lot of varieties of Hi-Flow, Henkel also has a variety of thicknesses for this material. Some of the Hi-Flows can be provided with PSA (Pressure Sensitive Adhesive). NEDC offers die-cutting (converting) services for Henkel materials, including Hi-Flow. For more information on Hi-Flow materials please visit Henkels’ website.

Note: All the information for this article was recorded from Henkel’s official website. Any use of the materials above should be tested in the application before practical use. NEDC is not liable for use of the above product in the application.