In our video “How do Thermal Interface Pads/Thermal Gap Fillers Work? A Demo!”, we explain the function and importance of thermal interface materials (TIMs) in electronic devices. TIMs, such as thermal pads and gap fillers, are used to bridge the gap between heat-generating components and heat sinks or enclosures, ensuring efficient heat transfer and preventing overheating.
The demonstration showcases how thermal pads conform to surface irregularities, filling air gaps that would otherwise impede heat conduction. By applying pressure, these pads adapt to the contours of the components, creating a reliable thermal pathway. The video emphasizes the significance of selecting appropriate TIMs based on factors like thermal conductivity, thickness, and compressibility to match specific application requirements.
Additionally, we highlight the differences between various types of thermal interface materials, including thermal pastes and pads, discussing their respective advantages and limitations. The video provides insights into the practical considerations for implementing TIMs in electronic assemblies, such as ease of application, reusability, and long-term performance.