As electronics continue to shrink and power densities rise, thermal interface materials must perform in increasingly tight spaces. Tflex™ UT20000 was engineered specifically for these challenges—delivering reliable thermal transfer in ultra-thin bond lines where...
Posts Written by: Garrett Abare
PORON® Soft-Seal: Ultra-Compliant Sealing for Thin, Sensitive Assemblies
When designers need a gasket material that seals reliably at very low closure forces, maintains its shape over time, and conforms to uneven or delicate surfaces, PORON® Soft-Seal is purpose-built for the job. This microcellular polyurethane foam is engineered for...
TPLI™ 200 Series Thermal Gap Filler: High-Performance Heat Transfer for Demanding Electronics
As power densities continue to rise across electronics, managing heat across uneven surfaces becomes increasingly critical. Tpli™ 200 Series Thermal Gap Filler is engineered for exactly this challenge—delivering exceptional thermal performance while remaining soft,...
ECCOSORB™ JCS-NEXT: A Next-Generation Absorber for Millimeter-Wave Noise
As operating frequencies push deeper into the millimeter-wave range, traditional EMI and cavity resonance solutions begin to fall short. Designs above 30 GHz—especially in 5G, automotive radar, and high-speed wireless systems—require materials that can effectively...
3M™ EMI Shielding Fabric Tape CN-3190 | Custom Die-Cutting
Instead of a solid metal foil, CN-3190 uses a copper-nickel plated ripstop polyester fabric backing. That construction gives it several real-world advantages: It bends and conforms easily around corners, seams, and uneven surfaces It’s lightweight but surprisingly...
Why Thermal Pads Became Standard in LED Lighting
LEDs are often marketed as “cool” lighting. That’s only true optically. Electrically, high-power LEDs convert a significant portion of input energy into heat at the junction. If that heat isn’t removed efficiently, LED performance degrades fast: Light output drops...
R10450 Reinforced Silicone Sponge: Dimensionally Stable Sealing from Saint-Gobain
Norseal® R10450 Reinforced Silicone Sponge from Saint-Gobain is a general-purpose, closed-cell silicone sponge designed for gasketing applications that require dimensional stability, controlled compression, and long-term environmental resistance. Unlike standard...
DC/DC Converter | Thermal Pad Requirements- Conducting Heat
Why They’re Needed, Where They’re Used, and How Heat Is Managed DC/DC converters are foundational components in modern electronic systems. Any device that takes power in at one voltage and distributes it internally at multiple regulated levels depends on DC/DC...
Memory Chips, Heat, and Why Thermal Pads Matter More Than You Think
When people think about heat in electronics, CPUs and GPUs usually steal the spotlight. They’re fast, power-hungry, and undeniably hot. But in real-world electronics design, memory chips are often where thermal pads quietly do the most work—and where overlooking heat...
HITHERM™ HT-1205, HT-1210, HT-2505, HT-2510 & HT-C3200 – Custom Die Cutting
Flexible Graphite Thermal Interface Materials for Long-Life, High-Reliability Electronics As electronics push higher power densities and longer service lives, traditional thermal greases and soft gap pads increasingly become reliability risks. Pump-out, dry-out, and...
SIL-PAD TSP A2000 aka Sil-Pad A1500 | High Performance Thermal Sil-Pad
When thermal performance, electrical isolation, and mechanical durability all matter, Sil-Pad® A1500 stands out as a reliable, field-proven thermal interface material. Designed for high-pressure clamping environments, A1500 is widely used in power electronics,...
UL-Listed Closed-Cell EPDM / Neoprene Rubber Blends- Durafoam™ DK Series
When applications demand reliable environmental sealing, flame resistance, and consistent mechanical performance, closed-cell EPDM / Neoprene blends are a proven solution. One of the most widely specified options in this category is the Durafoam™ DK Series, a family...
If Datacenters Go to Space, Heat Becomes the Hardest Problem
Every few years, an idea resurfaces that sounds futuristic enough to dismiss at first pass: datacenters in space. The knee-jerk reaction is predictable—space is freezing, so cooling must be easy. But that intuition is exactly wrong. Once you strip away that...
How NEDC Uses LOCTITE ABLESTIK ECF 550 in Electrically Conductive Assemblies
When an application requires electrical conductivity across bonded interfaces, material selection becomes non-negotiable. At New England Die Cutting (NEDC), one of the electrically conductive adhesive films we regularly work with is LOCTITE ABLESTIK ECF 550, a...
Understanding Henkel LOCTITE ABLESTIK ECF 561 and ECF 561E | Custom Converting
Understanding LOCTITE ABLESTIK ECF 561 and ECF 561E Electrically conductive epoxy films are often selected late in the design process, after mechanical layouts are finalized and electrical grounding requirements become unavoidable. Materials like LOCTITE ABLESTIK ECF...
T-Global Technology TG-AD30, TG-AD66, TG-AD75 | Super-Soft Thermal Pads!
As power densities continue to rise across aerospace, defense, AI hardware, and advanced electronics, thermal interface materials must do more than simply conduct heat. They must conform, insulate electrically, maintain reliability over time, and perform under uneven...
NEDC, a Converter for Qnity Electronics, formerly Laird/DuPont
New England Die Cutting: A Trusted Converter for Qnity Electronics Materials New England Die Cutting (NEDC) is a qualified converter for Qnity Electronics materials, supporting customers who rely on high-performance EMI shielding, thermal interface pads, and...
Airflow Management | HVAC Gaskets for Dust Sealing & More
Material Selection, Design Considerations, and Real-World Applications Effective airflow management depends on one deceptively simple component: the gasket. In HVAC systems, air handlers, plenums, and electronic enclosures, gaskets are responsible for controlling...
Cho-Seal 1215 Why Customers Source CHO-SEAL 1215 Converting Through NEDC
When an assembly needs reliable EMI shielding and environmental sealing—without turning into a tolerance nightmare—CHO-SEAL® 1215 is one of the go-to materials engineers reach for. It’s a conductive elastomer gasket material designed to create an electrically...
Eccosorb™ LS: Flexible, Lossy Foam Absorbers for RF & Microwave Control
When engineers need a lightweight, flexible microwave absorber that delivers consistent lossy performance, Eccosorb™ LS is one of the most widely used absorber families available. Built from carbon-loaded polyurethane foam, Eccosorb LS provides strong insertion-loss...
EPDM Rubber: Product Description & Understanding MIL-R-21252
EPDM rubber has been around for decades, and it hasn’t lost relevance for one simple reason: it works. When you need a gasket or seal that shrugs off weather, steam, sunlight, water, and general outdoor abuse, EPDM is one of the most dependable elastomers in the...
TGF70 Thermal Gap Filler: High-Performance Heat Management for Modern Electronics
As electronic devices become smaller, thinner, and more power dense, thermal management materials have turned into essential design components—not optional accessories. Leader Tech’s TGF70 thermal gap filler is built for exactly this environment. With high thermal...
TGF30 Thermal Gap Filler: A Flexible, Low-Pressure Solution for High-End Electronics
In many modern electronic assemblies—especially those involving precision imaging systems, smart sensors, and consumer electronics—designers need a thermal interface material that performs well even under low pressure while remaining flexible, compliant, and...
TGF80 Thermal Gap Filler: High-Performance Thermal Management for Next-Generation Electronics
As electronic assemblies continue to shrink while power density rises, effective thermal interface materials have become essential for reliability and performance. LeaderTech’s TGF80 thermal gap filler is engineered to provide outstanding thermal conduction, softness,...
Understanding 3M™ Adhesive Transfer Tapes with Adhesive 300: A Complete Guide to the 927, 950, 950EK, 9458, 9471, 9472, 9671, 9672, and 9674
When engineers need a pressure-sensitive adhesive that delivers excellent adhesion, high initial tack, and consistent performance across metals, plastics, and foams, the 3M™ Adhesive 300 family is often the first choice. This medium-firm acrylic adhesive system...
Thermal Gap Filler Pads in EBikes & E-Scooters, Personal Electric | High W/m-K, Low Impedance
Personal electric vehicles — e-bikes, e-scooters, EUCs (electric unicycles), and even high-performance electric skateboards — have exploded over the last five years. What started as a convenience category has evolved into a serious engineering platform with high-power...
T-Global TG-APC93 / PC93 Non-Silicone Thermal Pad | Custom Die Cutting
When engineers talk about thermal pads, the conversation usually swings between thermal conductivity, softness, and electrical isolation. But there’s an increasingly important factor that gets overlooked until it becomes a problem: silicone contamination. Some devices...
Sil-Pad 1200 aka SIL PAD TSP 1800 – The Ultimate Thermal Insulator
When engineers need a thermal interface material that is electrically isolating, durable, and consistent under mechanical stress, Bergquist Sil-Pad® 1200 aka SIL PAD TSP 1800 is one of the most trusted options on the market. It’s a silicone-based,...
Cho-Seal 6502, Cho-Seal 6503 Chomerics Die-Cut EMI Gasket/Shields
At NEDC, we convert a wide range of conductive elastomers for EMI/RFI shielding applications. Two of the most commonly specified nickel-aluminum filled materials are Cho-Seal 6502 and Cho-Seal 6503. These materials are closely related — same filler system, similar...
Cho-Seal 1287, and Cho-Seal 1285 | Custom Die Cutting of EMI Pads, Gaskets
When customers look for high-performance conductive elastomer gaskets, two of the most commonly requested materials are CHO-SEAL 1285 and CHO-SEAL 1287. Both materials use silver-plated aluminum (Ag/Al) as the conductive filler — but they differ in one critical way:...
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Ultra-Thin Thermal Performance with Tflex™ UT20000- Custom Die Cut
As electronics continue to shrink and power densities rise, thermal...
PORON® Soft-Seal: Ultra-Compliant Sealing for Thin, Sensitive Assemblies
When designers need a gasket material that seals reliably at very...






















