When thermal density is high and the voltage across the interface demands serious insulation, the top of the HV series becomes necessary. Parker Chomerics CHO-THERM HV3320 is the highest-conductivity grade in the CHO-THERM HV line, delivering 3.3 W per meter-Kelvin...
Posts Written by: Garrett Abare
CHO-THERM HV2320: Medium-Thickness High-Voltage Thermal Insulator
When voltage across the interface is aggressive and the assembly geometry allows a slightly thicker pad, the mid-tier HV grade becomes the practical choice. Parker Chomerics CHO-THERM HV2320 is a blue thermal insulator with a 0.020-inch profile, 2.3 W per meter-Kelvin...
CHO-THERM HV1110: Thinnest High-Voltage Thermal Insulator
When space inside an enclosure is limited and voltage across the thermal interface is moderate, the thinnest HV grade often makes the most sense. Parker Chomerics CHO-THERM HV1110 is a blue thermal insulator that delivers high-voltage isolation in a tight 0.010-inch...
CHO-THERM HV1717: Higher Conductivity in a Thin High-Voltage Pad
Engineers who need more thermal conductivity than the thinnest HV grade but cannot afford to add thickness often look for the next step in the series. Parker Chomerics CHO-THERM HV1717 delivers exactly that. It shares the same 0.010-inch profile as HV1110 but pushes...
CHO-THERM 1671 Thermal Pad: Top-of-Line Silicone Insulator with Highest Conductivity
When thermal density is extreme and commercial-grade pads fall short, Parker Chomerics CHO-THERM 1671 stands at the top of the standard CHO-THERM line. It is a white silicone pad rated at 2.6 W per meter-Kelvin, the highest conductivity in the standard series. Its...
CHO-THERM 1678 Thermal Pad: High-Performance Pink Silicone Insulator
For applications that demand both thermal conductivity and proven reliability in demanding environments, Parker Chomerics CHO-THERM 1678 delivers a compelling package. It is a pink silicone fiberglass pad rated at 2.0 W per meter-Kelvin with strong dielectric...
CHO-THERM T500 Thermal Pad: High-Performance Silicone Fiberglass Insulator
When a standard commercial-grade pad cannot handle the thermal density of your power semiconductors, the next step in the CHO-THERM line delivers significantly more headroom. Parker Chomerics CHO-THERM T500 is a green silicone fiberglass pad that pushes thermal...
CHO-THERM 1674 Thermal Pad: Versatile Blue Silicone Fiberglass Insulator
Sometimes the right thermal pad does more than conduct heat. It also needs to survive assembly, resist puncture, and maintain its dimensions under pressure. Parker Chomerics CHO-THERM 1674 is a blue silicone fiberglass pad that balances thermal performance with...
CHO-THERM T609 Thermal Pad: Higher-Conductivity Silicone Insulator
If your design has pushed past the limits of a basic silicone pad but does not require a premium high-performance grade, Parker Chomerics CHO-THERM T609 offers a logical upgrade. It is a gray silicone pad reinforced with fiberglass, delivering 1.5 W per meter-Kelvin...
CHO-THERM T441 Thermal Pad: General-Purpose Silicone Fiberglass Insulator
# CHO-THERM T441 Thermal Pad **Meta title:** CHO-THERM T441 | Silicone Fiberglass Thermal Pad | NEDC **Meta description:** CHO-THERM T441 is a 0.008 inch pink silicone fiberglass thermal insulator at 1.1 W per meter-Kelvin. Available on rolls with or without PSA at...
CHO-THERM T444 Thermal Pad: Thin Non-Silicone Insulator with PSA
When silicone contamination is a concern, finding a thermal insulator pad that still conducts heat reliably can be a challenge. Parker Chomerics CHO-THERM T444 is a beige non-silicone thermal pad designed for exactly that situation. Its 0.003-inch low-profile...
T-Work9000 Thermal Pad: The Ultra-High Performance Thermal Interface for Cutting-Edge Electronics
Heat is the enemy of performance in modern electronics. As chips push higher wattages into smaller packages, the thermal interface material between the silicon and the heatsink becomes one of the most critical components in the entire system. The T-work9000 thermal...
T-Work8000 Thermal Pad: High-Compression Thermal Management for Power Electronics
Power electronics operate under thermal stress that consumer devices rarely encounter. High current means high heat flux, and the thermal interface material separating a power module from its heatsink must handle both high heat load and the mechanical stress of...
T-Work7000 Thermal Pad: Ultra-Soft Thermal Management for Demanding Electronics
When thermal management gets serious, engineers need a gap filler that does more than conduct heat. They need one that conformably fills microscopic air gaps, maintains low thermal resistance under mounting pressure, and stays electrically insulating across a wide...
TFlex HD Thermal Pads | High Deflection | High Thermal Performance
Customers are looking for the best thermal performance when it comes to thermal interface materials. To get the best thermal performance, in my opinion in most cases, you don’t want to rely on much external pressure to get there. For that reason, we thought we’d write...
Ultra-Thin Thermal Performance with Tflex™ UT20000- Custom Die Cut
As electronics continue to shrink and power densities rise, thermal interface materials must perform in increasingly tight spaces. Tflex™ UT20000 was engineered specifically for these challenges—delivering reliable thermal transfer in ultra-thin bond lines where...
PORON® Soft-Seal: Ultra-Compliant Sealing for Thin, Sensitive Assemblies
When designers need a gasket material that seals reliably at very low closure forces, maintains its shape over time, and conforms to uneven or delicate surfaces, PORON® Soft-Seal is purpose-built for the job. This microcellular polyurethane foam is engineered for...
TPLI™ 200 Series Thermal Gap Filler: High-Performance Heat Transfer for Demanding Electronics
As power densities continue to rise across electronics, managing heat across uneven surfaces becomes increasingly critical. Tpli™ 200 Series Thermal Gap Filler is engineered for exactly this challenge—delivering exceptional thermal performance while remaining soft,...
ECCOSORB™ JCS-NEXT: A Next-Generation Absorber for Millimeter-Wave Noise
As operating frequencies push deeper into the millimeter-wave range, traditional EMI and cavity resonance solutions begin to fall short. Designs above 30 GHz—especially in 5G, automotive radar, and high-speed wireless systems—require materials that can effectively...
3M™ EMI Shielding Fabric Tape CN-3190 | Custom Die-Cutting
Instead of a solid metal foil, CN-3190 uses a copper-nickel plated ripstop polyester fabric backing. That construction gives it several real-world advantages: It bends and conforms easily around corners, seams, and uneven surfaces It’s lightweight but surprisingly...
Why Thermal Pads Became Standard in LED Lighting
LEDs are often marketed as “cool” lighting. That’s only true optically. Electrically, high-power LEDs convert a significant portion of input energy into heat at the junction. If that heat isn’t removed efficiently, LED performance degrades fast: Light output drops...
R10450 Reinforced Silicone Sponge: Dimensionally Stable Sealing from Saint-Gobain
Norseal® R10450 Reinforced Silicone Sponge from Saint-Gobain is a general-purpose, closed-cell silicone sponge designed for gasketing applications that require dimensional stability, controlled compression, and long-term environmental resistance. Unlike standard...
DC/DC Converter | Thermal Pad Requirements- Conducting Heat
Why They’re Needed, Where They’re Used, and How Heat Is Managed DC/DC converters are foundational components in modern electronic systems. Any device that takes power in at one voltage and distributes it internally at multiple regulated levels depends on DC/DC...
Memory Chips, Heat, and Why Thermal Pads Matter More Than You Think
When people think about heat in electronics, CPUs and GPUs usually steal the spotlight. They’re fast, power-hungry, and undeniably hot. But in real-world electronics design, memory chips are often where thermal pads quietly do the most work—and where overlooking heat...
HITHERM™ HT-1205, HT-1210, HT-2505, HT-2510 & HT-C3200 – Custom Die Cutting
Flexible Graphite Thermal Interface Materials for Long-Life, High-Reliability Electronics As electronics push higher power densities and longer service lives, traditional thermal greases and soft gap pads increasingly become reliability risks. Pump-out, dry-out, and...
SIL-PAD TSP A2000 aka Sil-Pad A1500 | High Performance Thermal Sil-Pad
When thermal performance, electrical isolation, and mechanical durability all matter, Sil-Pad® A1500 stands out as a reliable, field-proven thermal interface material. Designed for high-pressure clamping environments, A1500 is widely used in power electronics,...
UL-Listed Closed-Cell EPDM / Neoprene Rubber Blends- Durafoam™ DK Series
When applications demand reliable environmental sealing, flame resistance, and consistent mechanical performance, closed-cell EPDM / Neoprene blends are a proven solution. One of the most widely specified options in this category is the Durafoam™ DK Series, a family...
If Datacenters Go to Space, Heat Becomes the Hardest Problem
Every few years, an idea resurfaces that sounds futuristic enough to dismiss at first pass: datacenters in space. The knee-jerk reaction is predictable—space is freezing, so cooling must be easy. But that intuition is exactly wrong. Once you strip away that...
How NEDC Uses LOCTITE ABLESTIK ECF 550 in Electrically Conductive Assemblies
When an application requires electrical conductivity across bonded interfaces, material selection becomes non-negotiable. At New England Die Cutting (NEDC), one of the electrically conductive adhesive films we regularly work with is LOCTITE ABLESTIK ECF 550, a...
Understanding Henkel LOCTITE ABLESTIK ECF 561 and ECF 561E | Custom Converting
Understanding LOCTITE ABLESTIK ECF 561 and ECF 561E Electrically conductive epoxy films are often selected late in the design process, after mechanical layouts are finalized and electrical grounding requirements become unavoidable. Materials like LOCTITE ABLESTIK ECF...
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CHO-THERM HV3320: Highest-Conductivity High-Voltage Thermal Insulator
When thermal density is high and the voltage across the interface...
CHO-THERM HV2320: Medium-Thickness High-Voltage Thermal Insulator
When voltage across the interface is aggressive and the assembly...




























