Gap Pad® 5000S35, die-cuts, and sheet
NEDC has a number of popular products that it consistently converts through die cutting and waterjet cutting. Since no two pieces of metal will ever match up perfectly, Henkel offers a conformable line of products that will, called Gap Pad®. One of the most popular gap filling materials is Gap Pad® 5000S35 through Bergquist, a Henkel Company. The benefits, and features of Gap Pad® 5000S35 aka TGP5000 give heft to the popularity of the product. Gap Pad® 5000S35 features a convenient way to build thicknesses while maintaining high thermal conductivity, great surface topography conformability, and great physical properties.
Properties of Gap Pad 5000S35 aka TGP5000
This material features a fiberglass reinforced polymer, in order to resist tears and punctures during assembly and afterwards. The fiberglass allows for better handling when assembling electronics. It has a low hardness of 35 on the Shore OO scale, easily filling gaps. It also exhibits a high thermal conductivity, reaching a typical value of 5 W/m-k. This metric is the highest thermal conductivity in the Gap Pad® family. This is significant because of the applications Gap Pads are normally used in, requiring high thermal conductivity. It performs well even under low pressured systems. GP5000S35 also carries an incredible fire performance rating of UL 94 VO, one of the most stringent of the standard. In addition, GP5000S35 is part of the S-Class of Gap Pads. This Gap Pad® exhibits great natural tack on both sides of the product, allowing the material to naturally fill gaps such as air bubbles by wetting out onto the surface.
Applications for GP5000S35 aka TGP5000
-Aerospace Navigation Devices
-AI (artitical intelligence)
-CPUs, and other commercial electronics
-Power Supplies
Why Pick Gap Pad 5000S35 aka TGP5000 over other Thermal Pads?
Gap Pad 5000S35 has been used in military/aerospace applications since its inception over 30 years ago. It wouldn’t be a stretch to say that this TIM is a thermal pad selection of choice for customers who are in that industry. For that reason, its tried, and true. In fact, at NEDC, we tested Gap Pad 5000S35 on our TIM tester designed to test TIM (thermal interface materials) for thermal conductivity, and thermal impedence. its available in sheet sizes of 8” x 16” allowing to make thermal pads that are especially large.
Availability/Nomenclature of GAP PAD TGP5000
Filling in these air bubbles will reduce thermal resistance. The top layer of the material has less tack to help facilitate assembly. GP5000S35 is available in the color of an elegant light green. The thicknesses of GP5000S35 range from .020” all the way to .125” thick.
AI thermal pad chip
AI thermal pad chip
Legacy Part #s of GP5000S35 aka TGP 5000
GP5000S35-0.020-02-0816
GP5000S35-0.040-02-0816
GP5000S35-0.060-02-0816
GP5000S35-0.080-02-0816
GP5000s35-0.100-02-0816
GP5000S35-0.125-02-0816
These thicknesses are important in order for the gap filler to have the ability to build to the heat sink. Naturally an increase in thermal impedance is apparent as the thickness increases. For more information on this, please see the Bergquist website. Gap Pad® 5000S35 is also known by GAP PAD TGP 5000. If you have an application that requires a die cut thermal gap pad material such as Gap Pad® 5000S35 please contact sales@nedc.com.