As electronics continue to shrink and power densities rise, thermal interface materials must perform in increasingly tight spaces. Tflex™ UT20000 was engineered specifically for these challenges—delivering reliable thermal transfer in ultra-thin bond lines where traditional gap fillers struggle.
Designed for Thin Gaps and Low Pressure Assemblies
Tflex UT20000 is an ultra-thin, highly compliant silicone gap filler developed for applications with limited Z-height and low mounting force. Unlike reinforced thermal pads, UT20000 contains no embedded fiberglass carrier,- (this is rare) allowing the material to conform tightly to mating surfaces and reduce interfacial resistance.
This construction enables excellent surface wet-out, making UT20000 well suited for handheld electronics, compact enclosures, and assemblies where uneven surfaces or low clamp pressure are unavoidable.
Stability, Compliance, and Electrical Insulation
UT20000 is electrically non-conductive and remains stable across a wide operating temperature range, making it a dependable option for long-term thermal management. For applications requiring added electrical isolation or improved tear resistance during handling, polyimide (PI) film options are available on select thicknesses.
Key characteristics include:
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High compliancy for thin interfaces
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Consistent performance under low mounting forces
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Electrically insulating and flame-rated material
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Environmentally compliant (RoHS and REACH)
Thickness Options for Precise Fit
Tflex UT20000 is offered in thicknesses ranging from 0.008” (200 µm) up to 0.040” (1000 µm), with fine increments available to dial in the correct compression and thermal performance. Standard sheet sizes are available, along with roll formats for thinner gauges—ideal for automated assembly or high-volume production.
Custom Die Cutting from NEDC
At New England Die Cutting (NEDC), we convert Tflex UT20000 into precision die-cut thermal interface components, manufactured to your exact geometry. Whether you need simple pads, complex profiles, kiss-cut parts on liner, or roll-fed components for automation, we tailor each part to your assembly requirements.
Our team works closely with engineers to:
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Select the optimal thickness and construction
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Maintain tight dimensional tolerances
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Ensure clean edges and repeatable performance
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Support prototyping through full-scale production
When to Choose Tflex UT20000
UT20000 is an excellent choice when:
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Gap heights are minimal and space is constrained
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Low compression force is available
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Surface conformity is critical
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Long-term reliability is required in compact electronics
If your design demands thermal performance without sacrificing space, Tflex UT20000 is a proven solution.
Contact NEDC to discuss material selection, die-cut options, and fast-turn prototyping for your next thermal management challenge.