vram on a hot circuit board, thermal pad app
As power densities continue to rise across electronics, managing heat across uneven surfaces becomes increasingly critical. Tpli™ 200 Series Thermal Gap Filler is engineered for exactly this challenge—delivering exceptional thermal performance while remaining soft, compliant, and electrically insulating.
TPLI 200 is a premium silicone-based gap filler designed for applications where low thermal resistance, vibration absorption, and long-term reliability are non-negotiable. It is provided by Qnity-Laird.
What Makes TPLI™ 200 Different
At its core, TPLI 200 uses a boron nitride-filled silicone matrix, allowing it to achieve high thermal conductivity without sacrificing compliance. This balance is critical in real-world assemblies, where component stack-ups, tolerances, and mechanical stress can undermine rigid thermal solutions.
The result is a gap filler that conforms easily to surface irregularities while maintaining strong heat transfer performance across a wide range of thicknesses.
Key Performance Benefits
Tpli 200 offers a combination of properties that make it well-suited for advanced electronics and RF-dense environments:
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High thermal conductivity: 6.0 W/m·K
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Soft, compliant material: Shore 00 hardness of 70 for excellent surface contact
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Low thermal resistance: 0.25 °C-in²/W at 40 mils and 10 psi
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Wide operating temperature range: -45°C to 200°C
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Electrically insulating with high volume resistivity
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Shock and stress absorption to help protect components
These characteristics allow Tpli 200 to perform reliably in applications where vibration, thermal cycling, and mechanical mismatch are ongoing concerns.
Environmental and Regulatory Compliance
Tpli 200 is designed with modern compliance requirements in mind. It meets RoHS and REACH regulations, features low outgassing characteristics, and carries a UL 94 HB flammability rating, making it suitable for use in regulated electronic assemblies and enclosed systems.
Available Thicknesses and Configurations
The Tpli 200 Series is available in a broad thickness range to accommodate different gap requirements:
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Thicknesses from 0.25 mm (0.010”) up to 5.08 mm (0.200”) which is on the thicker side for a thermal gap filler pad
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Standard increments of 0.125 mm
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Optional fiberglass reinforcement in thinner gauges
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Adhesive options available on one side or no adhesive
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Optional post-cure for enhanced material stability
Standard sheet sizes include 16” x 16” and 8” x 8”, with custom configurations available for production use.
Typical Applications for TPLI 200
Tpli 200 is commonly used in:
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Telecom and 5G infrastructure
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Industrial control systems
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Automotive electronics
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High-power computing and networking hardware
Its combination of compliance and thermal efficiency makes it especially effective where air gaps, uneven mating surfaces, or component height variation are present.
Nomenclature for TPLI 200
TPLI 220-FG (.020” fiberglass interweave), TPLI 240 (.040”), TPLI 260-A1 (PSA one side .060”), TPLI 280-PC (.080” post cured for less outgassing)
A1= PSA one side
PC= post cured
FG-fiberglass carrier required for .010”, .015” and optional for .020” or .025”. However, its better to use fiberglass for .020” or .025” when handling is a concern. Keep in mind PSA (pressure sensitive adhesive) can interfere with performance when the material is tack only on one side.
Custom Die Cutting with NEDC (New England Die Cutting)
While Tpli 200 is available in standard sheet form, most production applications require precision-cut parts. New England Die Cutting (NEDC) specializes in custom die cutting of thermal interface materials like Tpli 200, producing tight-tolerance parts tailored to your exact design requirements.
NEDC supports prototyping through full-scale production, offering custom shapes, thickness selection, adhesive configurations, and clean handling suited for electronics manufacturing environments.