Autonomous robots are moving from concept to everyday workhorses — navigating warehouses, picking orders, assisting in hospitals, farming fields, and performing complex inspection tasks. To deliver this level of autonomy, robots must combine AI computing, high-density batteries, and precise actuation in compact enclosures. Heat, dust, moisture, and electrical risk all threaten uptime — which is why thermal interface materials (TIMs), gaskets, and electrical insulators are indispensable.
Where Gaskets & Insulators Protect Robots
Robots work long hours in tough spaces — dust, liquids, vibration, and temperature cycling are routine. Correct gasketing and insulation prevent failure and protect both electronics and mechanics:
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Battery & power modules — Closed-cell silicone sponge or fluorosilicone gaskets keep moisture and chemical vapors out; electrical insulators isolate busbars and high-voltage nodes.
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Sensor housings & vision systems — Expanded PTFE or silicone foam helps achieve IP ratings while equalizing pressure to avoid condensation.
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Joint and actuator assemblies — Gaskets damp vibration and cushion gearboxes, bearings, and servo housings.
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Electronics & control boards — Thin dielectric insulators such as polyimide or FR-rated films keep signals isolated and reduce the risk of shorts.
Key materials:
Silicone sponge & foam (temperature stability and compression set resistance), Viton® (chemical resistance), expanded PTFE (breathable yet water-tight), polyimide films (thin, high dielectric strength).
Thermal Pads & Onboard AI Inference — Why It Matters
Next-gen robots run AI inference locally to process camera and sensor data in real time. Modules with custom edge AI chips can hit very high heat flux. Without good thermal management, these chips throttle and decision-making slows — hurting safety and autonomy.
Thermal gap fillers protect performance by:
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Bridging uneven gaps between processors and heat sinks or chassis.
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Maintaining low thermal resistance while staying soft to avoid PCB damage.
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Managing high continuous loads where AI runs constantly.
Robotics-ready thermal pad choices:
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TFlex™ SF16 & SF10 (silicone-free) — Excellent softness, stable thermal conductivity without silicone outgassing or migration; ideal when silicone contamination is a concern (e.g., optical or sensor assemblies).
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Gap Pad® 6000ULM & 7000ULM (Ultra Low Modulus) — Extremely soft, conformable TIMs that minimize board stress while providing 6.0 and 7.0 W/m·K thermal conductivity respectively — ideal for dense GPU and edge AI processors.
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Other GAP PAD® grades (Bergquist/Henkel) — Broad conductivity range (1–6 W/m·K) and easy handling for varied assembly needs.
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Graphite or ceramic-filled pads — Extreme power density scenarios with minimal thickness.
By keeping inference chips cool, these materials help maintain:
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Consistent compute performance for vision, SLAM, and navigation.
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Energy efficiency — cooler chips draw less power.
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Long-term reliability — protecting expensive AI hardware from thermal fatigue.
Why Precision Converting Is Critical
Robot layouts are irregular and space-constrained; one size rarely fits all. Custom converting of pads, gaskets, and insulators provides:
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Exact fit and compression for complex housings and PCB outlines.
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Weight optimization by cutting only what’s needed.
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Consistent assembly across production, reducing variability.
At NEDC, we routinely convert TFlex™ SF16 & SF10, Gap Pad® 6000ULM & 7000ULM, silicone foams, and advanced insulators to precise CAD specs — enabling robotics teams to move from prototype to production with reliable, lightweight thermal and sealing solutions.