GPU in server room, thermal pad app
GPU in server room, thermal pad app
Tflex B200: A Versatile Thermal Gap Filler for Modern Electronics
When designing cutting-edge electronics—from EV battery packs to aerospace avionics and high-performance computing—managing heat effectively is mission-critical. That’s where Tflex B200 shines: a compliant thermal gap filler engineered to bridge the interface between heat-generating components and their thermal dissipation structures.
Key Highlights
-
Thermal Conductivity: 2.0 W/m·K (ASTM D5470)
-
Material Construction: Ceramic-filled thermal silicone sheet, naturally tacky on both sides—no adhesive required
-
Mechanical Compliance: Soft, low-modulus material conforms to surfaces, reducing mechanical stress and improving long-term reliability
-
Shock & Dielectric Protection: Excellent at absorbing shock in demanding environments and offers high dielectric breakdown protection (“high DBV”)
Thickness & Sizes
Available in thicknesses from approximately 1 mm to 5 mm in 0.25 mm increments; standard sheet sizes include 9″ × 9″ and 18″ × 18″—with custom die-cut options also available.
FG vs. MFG: Reinforcement Options Explained
Tflex B200 isn’t a one-size-fits-all solution—its FG and MFG variants provide added strength and application-specific flexibility:
Tflex B200MFG (Middle-Fiberglass-Reinforced)
-
Features a fiberglass layer embedded in the mid-section.
-
Retains tackiness on both sides, facilitating stable placement during both manual and automated assembly.
-
Enhances tensile strength, minimizing deformation—especially helpful during handling or in high-vibration environments.
-
Ideal for applications that require mechanical robustness without compromising assembly flexibility.
Tflex B200FG (One-Sided Fiberglass-Reinforced)
-
Includes fiberglass reinforcement positioned near one surface.
-
Offers higher deflection compared to MFG, meaning it resists breakthrough or compression more effectively on that reinforced side.
-
Best suited for scenarios where one surface is more fragile or requires extra protective reinforcement—like delicate chips or uneven heatsink surfaces.
Why Tflex B200 Stands Out
| Feature | Benefit |
|---|---|
| 2.0 W/m·K Thermal Conductivity | Delivers reliable thermal transfer across gaps in demanding designs |
| Compliant Silicone Construction | Aids stress relief and maintains intimate contact across uneven surfaces |
| Fiberglass Options (FG / MFG) | Adds customizable mechanical reinforcement tailored to your assembly needs |
| Tacky Surface Finish | Ensures secure placement without additional adhesives |
| Broad Applications | Effective across automotive, telecom, aerospace, consumer electronics, and more |
Final Thoughts on TFLEX B200/More Information
Whether you’re building robust EV battery packs that must withstand vibration or designing compact consumer electronics where every micron and contact point matters, Tflex B200 offers a blend of thermal performance, mechanical adaptability, and ease-of-use. Its FG and MFG variants provide the flexibility to choose the protection level that best suits your application’s unique stress points and manufacturing methods. NEDC does die-cutting, waterjet cutting, and other converting methods for thermal pads. For more information, please contact sales@nedc.com.