GPU in a datacenter, thermal pad application
GPU in a datacenter, thermal pad application
Meet the TG-A1780: A Thermal Pad that Delivers
The TG-A1780 is an ultra-soft, silicone-based thermal gap-filler pad from T-Global Technology, engineered for high-performance heat management. It boasts a thermal conductivity of 17.8 W/m·K, ensuring superior heat transfer, low thermal impedance, and excellent electrical insulation.
Technical Snapshot at a Glance of TG-A1780 Thermal Gap Filler
| Feature | Specification |
|---|---|
| Thermal Conductivity | 17.8 W/m·K ±10% |
| Thickness Options | 0.5 mm to 2.0 mm (approx. 0.0197–0.0787 in) |
| Hardness | 70 Shore 00 (approx. 65 Shore 00) |
| Temperature Range | –50 °C to +180 °C |
| Insulation & Safety | Dielectric strength ≥8 kV/mm, UL-rated V-0, REACH/RoHS compliant |
Strengths that Matter
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Premium Thermal Performance – The standout thermal conductivity ensures effective cooling—even in high-workload, or compact systems. Tack both sides of this pad, help get this pad to have ultra-high performance.
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Ultra-Soft Consistency – Easy to apply and adapts well to uneven surfaces, providing tight contact with minimal pressure.
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Robust Electrical Insulation – High dielectric strength offers protection in sensitive electronics. It serves as a good electircal insulator.
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Safety & Compliance – Certifications like UL-94 V0 and compliance with RoHS and REACH make this a dependable, regulation-respected choice.
Applications Across Industries
The TG-A1780 thermal gap filler finds its sweet spot in high-power, high-performance setups. Common application areas include:
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Servers and High-Performance Computing (HPC)
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5G infrastructure and Telecom/Gigabit Devices
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Automotive systems (e.g. EV electronics, power modules)
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Consumer electronics: PCs, CPUs, GPUs, LEDs
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Industrial, AIoT, robotics, medical devices, and aerospace systems
Why It Stands Out
Unlike stiff thermal pads that require extreme pressure or adhesives to conform to surfaces, the TG-A1780’s suppleness lets it fill gaps with ease and efficiency. Its versatility shines across various thickness options, making it a go-to for both handheld gadgets and large-scale server systems.
Final Thoughts of TG-A1780 Thermal Gap Filler/More Information
If you’re designing or upgrading a system that generates heat and demands reliability, the TG-A1780 is a compelling solution:
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High thermal conductivity ensures efficient heat dissipation
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Ultra-soft nature means versatility and effortless use
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Electrical insulation adds a layer of safety
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Broad application range—from consumer tech to industrial heavyweights
At NEDC, we die-cut all sorts of the thermal pads. For more information on thermal pads, please contact sales@nedc.com.