GPU racks, thermal pad
TG-A1450 Ultra Soft Thermal Pad: High Performance Where It Counts Most
In today’s demanding thermal environments—where components run hotter, tighter, and more compact than ever—reliable thermal interface materials (TIMs) are mission-critical. The TG-A1450 Ultra Soft Thermal Pad delivers exactly that: exceptional thermal performance in an ultra-conformable, easy-to-use format.
Why Choose Thermal Gap Filler Pad TG-A1450 from T-Global?
The TG-A1450 stands out for its thermal conductivity of 14.5 W/m·K, one of the highest available in silicone-based gap pads. But it’s not just about numbers—this pad is engineered to perform in real-world applications where low thermal impedance, and mechanical compliance are crucial.
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High Thermal Conductivity (14.5 W/m·K)
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Ultra Soft – Shore OO 55 Hardness for exceptional surface wetting, and gap filling
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Low Thermal Impedance even under low contact pressure
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High Dielectric Strength (≥8 kV/mm)
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Available in standard sheets or custom die-cut parts
Whether you’re solving thermal challenges in EV batteries, 5G modules, high-performance computing (HPC), servers, or AR/VR devices, TG-A1450 adapts with ease. Its soft, mechanical profile conforms to irregular surfaces, minimizing air gaps, and maximizing heat transfer. T-Global is a leader in thermal gap filling technology.
Performance Meets Flexibility for Thermal Gap Fillers
Offered in thicknesses from 0.5mm to 6.0mm, TG-A1450 can be die-cut to fit unique geometries. For high-volume manufacturing, it’s optimized to work seamlessly with pick-and-place and liner-removal processes—even at sub-1mm thicknesses. Thicker thermal gap filler pads are unique in this industry, so something available in such a thick format is unique.
Built for the Next Generation of Tech (AI)
Whether it’s cooling dense server racks, thermally managing AI chipsets, or dissipating heat in aerospace systems, TG-A1450 is built for the future of electronics. It’s REACH and RoHS compliant, flame-rated to UL 94 V-0, and electrically insulating.
Typical Applications for TG-A1450, Thermal Gap Filler
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Servers, and datacenters
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AI, 5G, and edge computing
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Telecom, and Netcom equipment
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Aerospace and defense systems
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Medical, and industrial equipment
If you’re ready to improve heat transfer and extend component longevity in your most demanding applications, TG-A1450 Ultra Soft Thermal Pad is your go-to solution. For more information on thermal gap filler pads, contact sales@nedc.com.