Why ThermaCool®
As power density climbs, thermal interfaces must bridge variable gaps, tolerate low clamp forces, and remain electrically insulating. Saint-Gobain’s ThermaCool® portfolio spans soft gap fillers, thermally conductive tapes, coated fabrics, and specialty solids/B-stage sheets, giving engineers a toolkit to tune bond-line thickness (BLT), compression force, and thermal impedance to the stack-up at hand.
Core Gap-Filler Platform (TC Series)
What they are: Soft, ceramic-filled silicone elastomers supplied as sheets with intrinsically tacky surfaces (no separate adhesive needed). Designed to accommodate wide component height tolerances at minimal compression force. Available in 0.5–7.0 mm nominal thicknesses (0.5 mm increments). Most variants carry UL 94 V-0 and RTI 150 °C ratings. Large sheet formats (up to 610 mm × 610 mm / 24″ × 24″) improve die-cut yield. Multiple surface options (tacky / non-tacky / fabric-reinforced) are available to suit handling and assembly.
Product snapshots & where they fit
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TC2006 – 1.6 W/m·K; Shore 00 ≈ 40; ~30 psi @ 50% (100 mil)
Use when you need a balanced softness/performance pad for sensitive electronics (telecom, aerospace) at moderate BLT. -
TC2007G – 1.6 W/m·K; Shore 00 ≈ 50; ~67 psi @ 50% (100 mil)
Higher cohesion and better handling for larger die-cuts or slightly higher load applications; cost-effective generalist. -
TC3006S – 1.4 W/m·K; Shore 00 ≈ 30; ~15 psi @ 50% (100 mil)
Extra-soft for very low load environments; ideal when you must compress > 45% at ≤ 15 psi without overstressing components. -
TC3008 – 3.0 W/m·K; Shore 00 ≈ 65; ~36 psi @ 50% (100 mil)
Higher conductivity option when thermal budgets are tight and the assembly can tolerate moderate compression forces (> 10% compression typical).
Reference thermal impedance @ 100 mil (30 % deflection):
TC2006 ≈ 2.03 °C·in²/W; TC2007G ≈ 1.97 °C·in²/W; TC3006S ≈ 2.23 °C·in²/W; TC3008 ≈ 0.92 °C·in²/W.
Typical applications across TC series: LCD displays, power supplies/transformers, LED lighting, automotive ECUs/inverters, notebooks/desktops/IPC, telecom/base stations, server/storage, memory modules, and heat-pipe interfaces.
Specialty Thermally Conductive Gap Fillers
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R10404 – A thermally conductive closed-cell sponge that combines gasketing + heat transfer + cushioning in one material. Useful where you need both sealing compliance and a thermal path.
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TC100 – Solid silicone rubber pad for filling air gaps under higher load force; choose when the assembly can apply meaningful pressure and you want a durable solid interface.
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TC100U – Uncured (B-stage) analogue of TC100. Supplied uncured so it can flow/wet surfaces under pressure and then cure in place, providing gap filling and bonding of dissimilar materials (thermal + mechanical joint). Choose when you need a permanent in-situ bond and can accommodate a cure step.
Thermally Conductive Tapes
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Kapton® K271 (Kapton MT + adhesive, one side): A thermally conductive, electrically insulating tape format for bonding heat spreaders/sinks where mechanical fasteners aren’t feasible or where a thin, clean assembly is preferred.
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TR3 Transfer Adhesives (acrylic): Thermally conductive acrylic transfer films that deliver bond strength and a heat path in one; useful for attaching sinks to flat, clean substrates with controlled BLT.
When to use tapes: Thin-interface assemblies, rework-friendly builds, or geometries that benefit from adhesive + thermal.
Thermally Conductive Coated Fabrics
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TF1860 Series: Lowest-cost thermally conductive silicone-coated fabric; selectable when you need a compliant, reinforced interface at minimal material cost.
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TF1870 Series: Similar architecture with improved thermal performance compared to TF400 series.
Both lines are optionally available with acrylic adhesive on one side to simplify placement.
Selection Guide (Engineering Heuristics)
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If your stack-up has large tolerance and very low allowable force:
→ Start with TC3006S (ultra-soft; ≤ 15 psi for ~50% at 100 mil). -
If you need a general-purpose soft pad with easy handling:
→ TC2006 (balanced softness/force) or TC2007G (higher cohesion for big die-cuts). -
If thermal headroom is tight and you can apply moderate pressure:
→ TC3008 (3.0 W/m·K; low thermal impedance). -
If you need a permanent thermal + structural bond:
→ TC100U (uncured B-stage; cures in situ to bond dissimilar materials). -
If you want adhesive-backed thin films for quick assembly:
→ K271 Kapton tape or TR3 transfer adhesives (thermally conductive, electrically isolating). -
If you need a reinforced, fabric-based thermal interface at low cost:
→ TF1860/TF1870 coated fabrics (optionally with acrylic PSA).
Product Comparison (Quick Reference)
| Product | Type | k (W/m·K) | Compressibility / Force (100 mil @ 50%) | Notes / Typical Use |
|---|---|---|---|---|
| TC2006 | Soft gap filler | 1.6 | ~30 psi | Balanced softness; broad electronics (telecom, aerospace). |
| TC2007G | Soft gap filler | 1.6 | ~67 psi | Higher cohesion; better handling for large parts. |
| TC3006S | Extra-soft gap filler | 1.4 | ~15 psi | Very low load; > 45% compression feasible at ≤ 15 psi. |
| TC3008 | Higher-k gap filler | 3.0 | ~36 psi | Lower thermal impedance; moderate force tolerance needed. |
| R10404 | Conductive sponge | — | — | Gasketing + thermal + cushioning in one. |
| TC100 | Solid silicone | — | Higher load | Solid pad for high-force interfaces. |
| TC100U | B-stage (uncured) sheet | — | Cures in place | Fills gaps and bonds dissimilar materials (thermal + mechanical). |
| K271 | Kapton® MT tape | — | — | Thermally conductive, electrically insulating tape. |
| TR3 | Acrylic transfer adhesive | — | — | Thermally conductive adhesive film. |
| TF1860/TF1870 | Coated fabric | — | — | Fabric-reinforced thermal layers; optional acrylic PSA. |
Final Take
Even if these aren’t your primary lines, knowing where TC2006 / TC2007G / TC3006S / TC3008 fit—and when TC100U’s in-situ curing is the right move—helps you steer designs toward safe, repeatable BLTs with the thermal margins they need. For thin, adhesive interfaces consider K271 or TR3; where reinforced, low-cost thermal layers are appropriate, TF1860/TF1870 fill the gap.