As semiconductor power density continues to climb, thermal interface materials must deliver both high conductivity and long-term reliability. Parker Chomerics THERM-A-GAP™ PAD 80LO is engineered specifically for these demands: a high-performance, low-oil-bleed, low-relaxation-force gap filler pad designed for mission-critical electronics.
What Is THERM-A-GAP™ PAD 80LO?
PAD 80LO is a conformable thermal gap filler pad with a typical thermal conductivity of 8.0 W/m·K. It provides the heat transfer of an advanced TIM while minimizing mechanical stress on sensitive components.
The “LO” designation stands for Low Oil, referencing its very low silicone oil bleed and migration. This reduces issues in manufacturing, long-term reliability concerns, and the cosmetic contamination that can result from traditional silicone pads.
Key Technical Features
-
Thermal Conductivity: 8.0 W/m·K
-
Thermal Impedance: 0.2 °C-in²/W (at 10 psi, 1 mm thick)
-
Operating Temperature Range: -55 °C to +200 °C
-
Hardness: 60 Shore 00 — optimized for compliance and reduced stress
-
Compression Force Relaxation: Nearly 90% reduction in force within 1 hour, ensuring low long-term stress on solder joints and components
-
Electrical Insulation: Dielectric strength 200 VAC/mil (8 kV/mm); dielectric constant 9.1 @ 1 MHz
-
Outgassing: TML 0.048%, CVCM 0.0034%
-
Regulatory Compliance: UL 94 V-0 flammability, RoHS compliant
Mechanical and Reliability Benefits
PAD 80LO was engineered to minimize mechanical stress on delicate devices like ICs, memory modules, and sensors. Its unique viscoelastic formulation provides:
-
Excellent conformability to uneven surfaces
-
Low stress relaxation force, reducing long-term clamping loads
-
Vibration dampening, protecting components under dynamic conditions
These traits make it well-suited to environments where thermal cycling and mechanical stress could otherwise degrade reliability.
Typical Applications
-
High-Performance Computing: CPUs, GPUs, ASICs, and memory modules
-
5G & Telecom Infrastructure: RF systems and high-density base stations
-
Automotive Electronics: Sensors, ADAS modules, and control units
-
Battery & Energy Storage Systems: Heat spreading in EV battery packs
-
Defense & Aerospace: Ruggedized systems requiring low-outgassing, high reliability
Design & Form Factor
-
Standard Thicknesses: 0.040″ to 0.200″ (1.0 mm to 5.0 mm)
-
Formats: Available in sheets (10″ × 15″) or custom die-cut parts to exact geometries
-
Deflection Range: 5–40%, depending on pressure applied
-
High Tack Surface: Reduces interfacial resistance and improves thermal contact
Key Takeaway for THERM-A-GAP PAD 80LO
THERM-A-GAP™ PAD 80LO is not just another thermal pad—it’s a system reliability enabler. With its combination of 8.0 W/m·K conductivity, low oil bleed, mechanical compliance, and electrical insulation, it is ideal for the next generation of power-dense, mission-critical electronics.
For designers working in computing, automotive, telecom, or defense sectors, PAD 80LO offers the thermal performance of high-end gap fillers with the long-term reliability needed for demanding environments.