THERM-A-GAP PAD 80: High-Performance 8.3 W/m-K Thermal Gap Filler
Managing heat in modern electronics has never been more critical. As devices shrink and power density rises, engineers require thermal interface materials (TIMs) that combine high thermal conductivity, mechanical compliance, and long-term reliability. The Parker Chomerics THERM-A-GAP® PAD 80 delivers exactly that — a high-performance thermal gap filler pad with 8.3 W/m-K thermal conductivity, low compression force, and excellent conformability.
Technical Overview
The THERM-A-GAP PAD 80 is designed for efficient heat transfer across rough, uneven, or irregular surfaces between heat-generating devices and heat sinks. Its soft formulation minimizes stress on delicate components while maximizing heat flow.
Key Properties:
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Thermal conductivity: 8.3 W/m-K
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Compression: Low force, with deflection up to 64% under load
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Electrical isolation: Provides insulation without sacrificing thermal performance
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UL 94 V0 rated: Meets stringent flammability safety standards
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Operating temperature range: -55 °C to 200 °C
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Outgassing compliant: Meets NASA standards with very low TML and CVCM levels
Carrier Options
PAD 80 is available in multiple carrier configurations, allowing engineers to balance handling, reinforcement, and assembly efficiency:
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PAD80 (unsupported): Maximum compressibility, no reinforcement
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PAD80A: Aluminum foil carrier with optional PSA for permanent bonding
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PAD80G: Woven glass carrier, offset to one side for structural stability
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PAD80PN: PEN film carrier for dimensional control during cutting and assembly
Performance Benefits
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Superior Thermal Transfer
At 8.3 W/m-K, PAD 80 significantly outperforms lower-grade gap fillers, making it suitable for high-power electronics where heat flux is elevated. -
Low Assembly Stress
With a Shore 00 hardness of 35, the pad compresses easily, conforming to component surfaces without generating excessive mechanical load. -
Flexible Thickness Range
Offered in 0.020” to 0.200” (0.51 mm to 5.1 mm), PAD 80 adapts to a variety of gap dimensions, from compact devices to large heat spreaders. -
Regulatory and Reliability Advantages
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UL 94 V0 flammability rating ensures compliance in safety-critical systems
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RoHS compliant
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Long shelf life up to 36 months (18 months for PSA-backed versions)
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Application Areas
The versatility of PAD 80 makes it ideal for industries where high performance, and reliability intersect:
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5G and Telecom equipment — dissipating heat from radio units and high-power amplifiers
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Smart home devices — ensuring thermal stability in compact enclosures
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Automotive electronics — from ADAS modules, to EV power systems
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LED lighting — managing concentrated hotspots
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Power supplies and converters — reducing thermal resistance in dense assemblies
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Servers and computing modules — protecting processors, memory, and storage units under heavy workloads
Why Choose THERM-A-GAP PAD 80?
Unlike commodity gap fillers, THERM-A-GAP PAD 80 is engineered for demanding, next-generation applications. Its combination of ultra-high thermal conductivity, low compression force, multiple carrier choices, and proven reliability makes it one of the most versatile TIMs available today.