THERM-A-GAP PAD 30 Series: Versatile Thermal Gap Fillers for High-Performance Electronics

When it comes to managing heat in compact, high-power electronic designs, Parker Chomerics’ THERM-A-GAP PAD 30 series is a proven solution. With a thermal conductivity of 3.0 W/m-K and excellent mechanical compliance, these silicone-based pads are designed to eliminate air gaps, ensure electrical insulation, and maintain long-term reliability.

The series includes multiple variants — THERM-A-GAP PAD 30, 30PN, 30G, and 30A — each engineered for specific assembly or durability requirements.

Core Technical Properties

• Thermal Conductivity: ~3.0 W/m-K

• Material Family: Silicone-based thermal gap filler pads

• Electrical Properties: High dielectric strength for insulation between components and heatsinks

• Operating Temperature Range: Stable from -40 °C to beyond 100 °C

• Compliance: Conformable surface to reduce interface resistance and stress on fragile components

These properties make the series adaptable across power supplies, telecom, automotive ECUs, industrial controllers, and consumer electronics.

Breakdown of the Variants

🔹 THERM-A-GAP PAD 30

The baseline material, delivering consistent 3.0 W/m-K conductivity with a strong balance between cost and performance. Supplied in sheet form and can be die-cut into precise geometries.

🔹 THERM-A-GAP PAD 30PN

This version includes a PEN (polyethylene naphthalate) carrier film. The carrier provides dimensional stability, improved handling, and resistance to tearing, making it ideal for automated assembly lines or repeatable placement where consistency is critical.

🔹 THERM-A-GAP PAD 30G

A fiberglass-reinforced variant, designed for even greater mechanical strength and rigidity. Well-suited for designs where pads have intricate cutouts or must maintain form during high-volume handling.

🔹 THERM-A-GAP PAD 30A

Optimized for enhanced adhesion and placement control. The built-in tack helps pads stay aligned during assembly, reducing rework and ensuring consistent thermal contact in production environments.

Why Engineers Choose the THERM-A-GAP PAD 30 Series

1. Performance Balance – At 3.0 W/m-K, the series fits mid-power density designs without the cost of ultra-high conductivity pads.

2. Electrical Safety – All variants maintain dielectric properties, protecting circuits from accidental shorts.

3. Mechanical Compliance – Pads conform to uneven surfaces, filling air gaps and lowering thermal resistance.

4. Variant Flexibility – PEN carrier (30PN), fiberglass reinforcement (30G), and adhesive tack (30A) allow tailored solutions.

5. Long-Term Reliability – Silicone formulation resists pump-out, dry-out, and degradation, ensuring stable performance.

Handling & Assembly Best Practices

• Surface Prep: Clean surfaces before placement to ensure contact integrity.

• Compression: Aim for 10–30% deflection to achieve rated performance.

• Cutting Options: Supplied in sheet or roll form, available die-cut with tight tolerances.

• Storage: Store in cool, dry conditions to maintain material integrity

Conclusion THERM-A-GAP PAD 30

The THERM-A-GAP PAD 30 series — including 30, 30PN, 30G, and 30A — provides engineers with a flexible platform for thermal management. Whether you need standard performance, dimensional stability with a PEN carrier, fiberglass reinforcement, or enhanced adhesion, this family of pads ensures reliable heat dissipation, electrical insulation, and mechanical protection across industries.

For custom die-cut THERM-A-GAP PAD 30 solutions, NEDC delivers precision converting services to meet exact specifications, from prototype to high-volume production.