Managing heat inside compact electronics can be challenging, especially when surfaces aren’t perfectly flat or clamping force is limited. Therm-A-Gap® HCS10 from Parker Chomerics solves that problem — it’s a highly conformable, flame-retardant thermal gap filler that moves heat efficiently while protecting delicate components.
What Sets HCS10 Apart
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Extreme softness & compressibility — rated around 35 Shore 00, HCS10 fills voids and irregular surfaces with very low mechanical stress.
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Thermal conductivity ~1.0 W/m·K — reliable heat transfer for moderate power densities and general electronics cooling.
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Flame-retardant & safe — UL 94 V-0 rated and RoHS compliant, suitable for safety-critical or enclosed spaces.
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Wide temperature stability — performs from –67 °F to +392 °F (–55 °C to 200 °C) without losing integrity.
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Low outgassing — clean for sensitive optics, sensors, and sealed devices.
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Carrier versatility — choose from:
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HCS10G: glass carrier version, excellent for easy handling, rework, and maximum softness.
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HCS10A: aluminum carrier version with pressure-sensitive adhesive (PSA) for quick peel-and-stick installation and secure placement.
- OR HCS10 with no carrier
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These options give designers flexibility in assembly and serviceability.
Ideal Applications
HCS10 works well anywhere heat must cross imperfect gaps:
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Telecom & data infrastructure — between processors and metal housings or chassis
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Consumer and automotive electronics — ECUs, controllers, ADAS modules
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LED & lighting systems — behind driver boards or housings exposed to heat
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Power conversion & storage — inverters, converters, battery controllers
Its softness also provides vibration damping, adding mechanical protection along with thermal management.
Format & Integration Options
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Available in standard sheets (9″ × 9″ and 18″ × 18″) or custom die-cut parts built to your print.
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Offered in HCS10G (glass carrier) or HCS10A (aluminum carrier with PSA backing) to suit different assembly needs, or HCS10 with no carrier.
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Thickness options from 0.010″ to 0.200″ for a wide range of gaps.
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Easy to die-cut, waterjet, or laminate for complex shapes and assemblies.
Quick Design Guidance
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Plan for 30–60% compression to achieve optimal thermal contact and mechanical fit.
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Select HCS10G if you want maximum softness and easy repositioning; choose HCS10A for assembly speed and permanent placement.
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Consider reinforced options if spanning large gaps or if pads will see mechanical movement.
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For higher heat loads, evaluate pairing with higher-conductivity materials in critical zones.
Bottom Line
Therm-A-Gap® HCS10 offers an ideal balance of softness, compliance, and thermal conductivity, plus the flexibility of two carrier options — HCS10G (glass) for rework-friendly builds and HCS10A (aluminum + PSA) for fast, secure assembly. It’s perfect for electronics, lighting, automotive modules, and power devices where heat management and low clamp force are essential.
Need custom-cut thermal pads? We can supply HCS10 in your exact shape, thickness, and carrier configuration — HCS10G or HCS10A — to streamline your build and keep your components cool. NEDC does custom die-cutting, and waterjet cutting for different parts.