Thermal management in compact electronics requires a balance between thermal conductivity, compressibility, and mechanical compliance. The THERM-A-GAP™ 579 series addresses this balance by delivering ~3.0 W/m·K thermal conductivity with exceptional softness (30 Shore 00 hardness). Its ability to conform under minimal pressure enables reliable heat transfer across uneven surfaces without introducing mechanical stress to sensitive components. This whitepaper provides a technical overview of the material, its available carrier variants, best practices for handling, and the key reasons why THERM-A-GAP 579 has become a trusted solution for design engineers.
Material Properties and Performance
Thermal Performance
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Thermal Conductivity: ~3.0 W/m·K
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Thermal Resistance: Low interface resistance due to inherent surface tack and high compliance
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Operating Temperature Range: Broad stability from sub-zero environments up to elevated conditions near 200 °C (application-dependent)
Mechanical Compliance
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Hardness: 30 Shore 00 (extremely soft and pliable)
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Compression Behavior: Maintains excellent conformability under low clamping force, which reduces the risk of PCB warpage or solder joint stress
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Recovery: Retains shape and maintains contact over multiple compression cycles, reducing long-term pump-out issues common in less resilient pads
Safety and Standards
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Flammability: UL 94 V-0
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Compliance: RoHS and REACH compliant
Variants in the THERM-A-GAP™ 579 Family
The 579 series is manufactured in multiple variants, allowing engineers to align carrier type and adhesive strategy with assembly requirements:
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THERM-A-GAP 579 (standard) – Carrier-free pad for maximum softness and compliance.
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THERM-A-GAP A579 – Aluminum foil carrier with PSA backing. Provides dimensional stability and permanent adhesion, ideal for vibration-prone environments.
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THERM-A-GAP G579 – Woven glass carrier, no PSA. Recommended where repositioning may be required.
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THERM-A-GAP 579KT – Polyimide film carrier. Offers enhanced dielectric strength and thermal reliability, suitable for high-performance electronics exposed to harsh environments.
Handling and Assembly Guidelines
The softness and tack of THERM-A-GAP 579 simplify integration, but careful handling ensures consistent results:
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Liner Removal – Remove release liners gradually while supporting the pad with a flat tool to avoid stretching or tearing.
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Placement – Position with minimal force; inherent tack is sufficient to hold pads in place during assembly.
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Compression Force – Avoid over-compression. Pads are engineered for effective contact at low clamping pressures; excessive force can reduce pad thickness recovery.
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Cutting/Die-Cutting – Sharp tooling ensures precise, burr-free cuts. Dull blades may distort edges due to pad softness.
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Storage – Store in original liners, in clean environments free from particulates. Contaminants on tack surfaces can increase thermal resistance.
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Rework Considerations – For prototypes or adjustable designs, G579 glass carrier versions allow easier removal and reuse compared to unsupported pads.
Application Domains
THERM-A-GAP 579 is deployed across industries where thermal dissipation and mechanical compliance must coexist:
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Automotive Electronics – ECU modules, ADAS controllers, power inverters, and sensors where vibration resistance is critical.
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Telecommunications Equipment – Base stations and optical transceivers requiring long-term reliability in fluctuating outdoor environments.
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Consumer Devices – Mobile devices, gaming consoles, and laptops where compact packaging demands high compliance and thin-gap performance.
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LED Lighting and Displays – Driver boards and light engines, where maintaining lumen output depends on consistent junction-to-sink thermal transfer.
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Data Centers and Power Conversion – Power supplies, memory modules, and server blades where density is high and airflow is constrained.
Why Engineers Choose THERM-A-GAP 579
The continued selection of THERM-A-GAP 579 in new and legacy designs stems from three defining advantages:
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Ultra-Soft Compliance – Minimizes stress on fragile assemblies, ensuring long-term mechanical integrity.
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Consistent Thermal Path – Maintains contact stability over wide temperature and compression cycles, outperforming stiffer pads in reliability testing.
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Assembly Efficiency – Tack, carrier options, and predictable compression behavior reduce rework time, scrap rates, and variability in mass production.
Conclusion
THERM-A-GAP™ 579 and its variants (A579, G579, 579KT) represent a benchmark in thermal gap filler technology—delivering consistent ~3.0 W/m·K conductivity, industry-standard compliance, and unparalleled softness. Its combination of thermal performance, mechanical compliance, and handling ease makes it a trusted material in applications spanning automotive, telecom, consumer electronics, and high-performance computing.
For engineers facing challenges with uneven surfaces, fragile assemblies, or tight tolerances, THERM-A-GAP 579 provides a proven, field-tested solution that integrates seamlessly into both prototype development and scaled production environments. NEDC doe custom die cutting, and waterjet cutting for applications.