thermal pad tgp 5000, tgp 3000
As the supply chain issues have taking a toll on the whole world, there is a lot of discussion around finding alternatives for some materials. Since NEDC supplies thermal pads, I wanted to point out a few materials that can be reviewed for similarities when trying to find an equivalent.
Comparing the Pads
TGP 5000(Gap Pad 5000S35)/TGP HC5000(Gap Pad HC5.0)
Similarities
Thermal Conductivity: 5 W/m-K
Operating Temperature: Same
UL V0: Both compliant
Excellent Volume Resistivity
Big Differences:
-Gap Pad HC5.0 is slightly less dense.
-Gap Pad HC5.0 has slightly better thermal performance in the ASTM D5470 fixture.
-Gap Pad HC5.0 is much better in standard outgassing tests
When comparing materials, it does not get much closer than Gap Pad HC5.0 and Gap Pad 5000S35. They are extremely similar thermal pads. Naturally, it is of the utmost importance to test to ensure it will qualify for the application.
TGP 3000(Gap Pad 3000S30)/TGP HC3000(Gap Pad HC3.0)
Similarities
Thermal Conductivity: 3 W/m-K
Operating Temperature: Same
Tack: Both Double Sided
Density: 3.1 vs 3.2
UL V0: Both compliant
Excellent Volume Resistivity
Big Differences:
-Hardness Shore 00
-Young’s Modulus
Basically, the large difference between the two pads is slight differences in the ability of the pad to wet out onto the applications surfaces, with Gap Pad TGP HC3000 being slightly better in this regard.
More Information/Contact Info
As mentioned above, its of the highest importance to test in an application when reviewing alternatives. NEDC die-cuts, or otherwises converts these thermal pad sheets into finished thermal pads. For more information on TGP 5000, TGP HC3000, TGP HC5000, or TGP 3000, please contact sales@nedc.com.