electronic box, metallic aluminum
As electronic assemblies continue to shrink while power density rises, effective thermal interface materials have become essential for reliability and performance. LeaderTech’s TGF80 thermal gap filler is engineered to provide outstanding thermal conduction, softness, and electrical insulation—ideal for modern compact designs that demand stability under tight tolerances.
At NEDC, we convert TGF80 into custom die-cut pads and shapes, giving engineers exactly what they need for efficient and repeatable installation in production environments.
What Is TGF80?
TGF80 is a silicone-based thermal gap filler designed to bridge air gaps between hot components and cooling hardware. Its combination of natural tack, conformability, and low thermal resistance makes it highly effective for applications where surface irregularities or low clamping forces exist.
Key Features
TGF80 offers a mix of mechanical and thermal performance characteristics that make it suitable for a wide range of applications:
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8.0 W/m·K thermal conductivity
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Low thermal resistance
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UL94 V-0 flame rating
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Excellent electrical insulation
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Soft 50 Shore 00 hardness for sensitive components
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Operating temperature from –40°C to +130°C
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RoHS and halogen compliant
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Available in 0.5 mm to 3.0 mm thicknesses
This balance of properties ensures both performance and design flexibility.
Typical Applications
TGF80 is commonly used in:
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High-power chips and heat-dissipation modules
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Optoelectronic systems
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New-energy and automotive battery systems
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Consumer appliances
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Wearable, and ultra-thin devices
Its ability to fill micro-voids and uneven contact areas makes it ideal for today’s increasingly dense, compact electronics.
Electrical Performance
Beyond thermal capability, TGF80 brings strong electrical insulation qualities:
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Breakdown voltage of approximately 3 kV/mm
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High volume resistivity
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Stable dielectric constant and low dielectric loss at 1 MHz
This makes it suitable for assemblies where thermal and electrical isolation must work hand-in-hand.
How NEDC Supports TGF80
NEDC converts TGF80 into custom die-cut thermal pads tailored to the exact geometries needed for your application. Whether it’s a simple rectangle or a complex multi-cut pad for a densely populated PCB, we provide repeatable, production-ready parts that drop cleanly into your assembly process.
Our converting services support:
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Prototyping
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Small and medium runs
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High-volume production
TGF80’s softness and conformability pair extremely well with precision die-cutting, ensuring consistent thermal contact where it matters most.
Storage & Shelf Life
TGF80 should be stored:
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In darkness
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At temperatures below 30°C
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At humidity below 70%
Under proper storage conditions, the material carries a two-year shelf life.
Conclusion
Leader Tech’s TGF80 thermal gap filler delivers strong thermal conductivity, electrical insulation, and compliance—making it a smart choice for engineers working on next-generation power electronics, EV systems, telecom hardware, and compact consumer devices. With NEDC’s custom die-cutting capabilities, integrating TGF80 into your design becomes straightforward, efficient, and production-ready.