gpu thermal pad requirements
At NEDC, we routinely die-cut thermal gap fillers like TGF70 into custom shapes to help customers integrate them seamlessly into assemblies across aerospace, defense, industrial electronics, and high-performance computing.
What Makes TGF70 Stand Out
TGF70 is engineered around performance, compliance, and reliability.
1. High Thermal Conductivity
With a rated thermal conductivity of 7.0 W/m·K, TGF70 delivers high-end thermal performance suitable for applications with elevated heat flux or strict temperature requirements.
2. Excellent Mechanical Compliance
Electronics rarely have perfectly level surfaces or predictable stack-ups. TGF70 solves this with:
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Softness around 50 Shore 00
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Compressibility of ≥15% at 50 PSI
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Thicknesses from 0.5 mm to 3 mm
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Natural tack that helps it stay in place during assembly
This softness and conformability reduce mechanical stress and ensure consistent thermal contact.
3. Strong Electrical Insulation
For applications where both thermal transfer and electrical isolation matter, TGF70 offers:
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Breakdown voltage ≥ 3 kV/mm
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Volume resistivity ≥ 10¹⁰ Ω·cm
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Low dielectric loss
This combination is particularly valuable in high-voltage electronics or mixed-signal environments.
4. Safety & Compliance
TGF70 is built to meet modern safety and environmental expectations:
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UL94 V-0 flammability rating
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RoHS and Halogen-free
Where TGF70 Fits Best
TGF70 is commonly used in:
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Interfaces between chips, and heat spreaders/heatsinks
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Optoelectronic modules
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Networking and telecommunications equipment
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EV battery systems and automotive electronics
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Household and consumer appliances
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Wearable devices
Its operating temperature range of –50°C to 150°C makes it suitable for both consumer and industrial environments.
Key Material Properties
Thermal Performance
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Thermal Conductivity: 7.0 W/m·K
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Thermal Resistance: ≤0.3 °C/W @ 20 PSI / 1 mm
Mechanical Properties
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Tensile Strength: ≥0.1 MPa
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Elongation: ≥45%
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Hardness: 50 ±10 Shore 00
Electrical Properties
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Breakdown Voltage: ≥3 kV/mm
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Dielectric Constant: ≥5 @ 1 MHz
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Dielectric Loss: ≤0.1
These characteristics create a balance of heat transfer, mechanical compliance, and electrical safety that designers rely on.
Storage & Handling
To maintain its properties over time, TGF70 should be stored:
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In darkness
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Below 30°C
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Below 70% humidity
Shelf life:
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Up to 2 years under recommended conditions
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Approximately 6 months if stored outside of spec
Why Engineers Choose NEDC for TGF70
When customers need thermal pads converted into custom geometries, NEDC supports them with:
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Precision die-cutting
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Rapid prototyping
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Scalable production
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Engineering support during thermal interface design
TGF70’s combination of high conductivity, softness, and electrical insulation makes it a natural fit for demanding applications where tolerance stack-ups, uneven surfaces, or tight thermal budgets exist.
Final Thoughts
TGF70 is a robust thermal gap filler designed for modern electronics where both heat management and electrical insulation are critical. Its 7 W/m·K performance, mechanical compliance, and safety certifications make it a strong candidate for engineers working in compact, high-power, or rugged environments.