TG-A6200 versus TG-A6200LC Thermal Gap Filler
In today’s high-performance electronics world—spanning AI, 5G, automotive, and medical tech—the efficient management of heat is critical. T-Global’s TG-A6200 and its enhanced counterpart TG-A6200LC are designed specifically to tackle these challenges by minimizing thermal resistance while staying easy to handle.
TG-A6200: The Ultra-Soft Thermal Pad
Key Features
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Thermal Conductivity: 6.2 W/m·K—excellent for transferring heat efficiently.
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Softness & Compression: Ultra-soft with high compressibility and natural tack—facilitating seamless contact with irregular surfaces.
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Specifications: Shore 00 hardness approximately 50, dielectric breakdown voltage about 6 kV/mm.
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Operating Temperature Range: –50 °C to +180 °C.
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Flame Resistance: UL94 V0 rated for safety in demanding environments.
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Applications: Ideal for gap-filling tasks in 5G gear, automotive modules, robotics, AR/VR devices, servers, and more.
Why It Matters
Perfect for applications requiring adaptability to surface irregularities—its softness and adhesion ensure consistent thermal performance.
TG-A6200LC: Enhanced Handling with High Performance
Key Features
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Composite Structure: Merges the ultra-soft core of TG-A6200 with a reinforcing carrier for better handling and reduced tack.
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Thermal Conductivity: Slightly lower at 5.0 W/m·K, still extremely efficient.
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Thickness Range: Available between 0.5 mm and 2.5 mm, flexible for different design needs.
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One-sided Low Tack: Makes placement and rework far easier—especially useful during assembly.
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Impressive Specification Details: Dielectric breakdown ≥ 6 kV/mm, operating temperature range from –50 °C to +180 °C, flame resistance UL94 V-0, density around 3 g/cm³.
Why It Matters
Blending performance with practicality, TG-A6200LC is a great fit for applications demanding both thermal efficiency and ease during manufacturing or servicing.
Specification Comparison
| Feature | TG-A6200 (Ultra-Soft) | TG-A6200LC (High-Performance) |
|---|---|---|
| Thermal Conductivity | 6.2 W/m·K | 5.0 W/m·K |
| Material Softness | Ultra-soft & high compressibility | Soft core with sturdy carrier |
| Tackiness | Natural tack (both sides) | Low tack (one side) |
| Thickness Options | Various | 0.5–2.5 mm |
| Dielectric Breakdown Voltage | ~6 kV/mm | ≥ 6 kV/mm |
| Temperature Range | –50 °C to +180 °C | –50 °C to +180 °C |
| Flame Retardancy | UL94 V-0 | UL94 V-0 |
Choosing Between the Two
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Pick TG-A6200 if your setup demands a conformable, soft pad that maximizes contact and thermal transfer—ideal where precision fitting is key.
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Opt for TG-A6200LC when you need similar thermal efficiency but prefer easier handling during assembly or have rework considerations—especially in larger-scale module assembly.
Final Thoughts
T-Global’s TG-A6200 and TG-A6200LC each bring unique strengths to thermal management solutions. The TG-A6200 stands out for its adaptability and thermal performance, while the TG-A6200LC offers added durability and assembly convenience without sacrificing much in heat transfer capabilities. The choice boils down to whether ease of handling or peak thermal performance is your priority. NEDC does die-cutting of both TG-A6200 and TG-A6200LC. For more information on thermal gap fillers, please contact sales@nedc.com.