cpu chip uncovered electronic, app for a thermal pad

cpu chip, app for thermal pad

TG-A38KX by T-Global — High-Performance Thermal Pad for Demanding Applications

Introduction: What Makes TG-A38KX Stand Out?

The TG-A38KX from T-Global is a high-performance silicone-based thermal pad designed to deliver exceptional thermal interface performance in demanding environments. Engineered with superior gap-filling properties, it maintains consistent performance from –40 °C to +200 °C, making it a go-to solution for engineers seeking both durability and efficiency.


Key Technical Advantages

Feature Benefit
Thermal Conductivity ~3.8 W/m·K — effectively reduces thermal resistance
Thickness Range 0.3 mm up to 10 mm — accommodates a variety of gaps
Operating Temp Maintains performance from –40 °C to 200 °C
Electrical Safety Dielectric breakdown ≥10 kV/mm — excellent insulation
Fire Safety Rating UL 94 V-0 — flame-retardant and safe
Mechanical Resilience Shore OO hardness ~60; elongation ~110%
Density & Weight Loss ~3.1 g/cm³ and <1% weight loss — stable characteristics

These specifications make TG-A38KX a dependable performer in applications where reliability is critical.


Built for Practicality

  • Gap-Filling & Conformable – The silicone base with thermally conductive filler conforms to uneven surfaces, ensuring minimal interface resistance.

  • Secure Placement – Available with tackiness on one or both sides for easy handling and assembly.

  • Durable & Stable – Maintains performance after repeated compression, making it suitable for long-life applications.


Typical Applications

  • Consumer Electronics – Smartphones, VR/AR devices, gaming consoles, power supplies.

  • Automotive & EV – Power electronics, battery modules, infotainment systems.

  • Data Center & AI – High-density servers, GPUs, AI accelerators.

  • Communications – 5G base stations, telecom equipment.

  • Industrial & Medical – Robotics, imaging systems, diagnostic equipment.

  • Aerospace & Defense Ruggedized field electronics, avionics.

  • Lighting & Energy – LED lighting systems, solar inverters, power storage units.


Sourcing & Configurations

  • Custom Sizes – From compact modules to full-sheet configurations.

  • Flexible Options – Thicknesses from 0.3 mm to 10 mm; tacky on one or both sides.

  • Shelf Life – Up to 24 months depending on configuration.


Why It Matters

The TG-A38KX strikes a balance between high thermal performance, mechanical resilience, and ease of integration. Whether it’s keeping a next-gen AI processor cool, managing heat in EV battery packs, or stabilizing performance in a ruggedized defense system, this thermal pad helps ensure devices run reliably in any environment. For more information on thermal gap fillers, please contact sales@nedc.com.

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