GPUs thermal gap pad application
TFLEX™ P300: A Polyimide-Lined Gap Filler Built for Tough Thermal Challenges
When it comes to managing heat in modern electronics, one size rarely fits all. From compact consumer devices to rugged aerospace modules, each design poses its own mechanical and thermal challenges. That’s where TFLEX™ P300, a high-performance thermal gap filler from Laird, proves its value.
What Is TFLEX P300 Thermal Gap Filler?
TFLEX P300 is a soft, compliant, thermally conductive gap filler designed with versatility and performance in mind. Its standout feature is an integrated polyimide liner—a strategic addition that enhances the material’s durability and handling during assembly, especially in applications with shear stress or tight mechanical tolerances.
At its core, TFLEX P300 delivers 3.0 W/mK of thermal conductivity, effectively channeling heat away from sensitive electronics to maintain reliability, and performance. Whether you’re designing for high-power automotive modules or compact consumer devices, this gap filler helps close the thermal loop.
Why TFLEX P300 Stands Out
Polyimide Reinforcement for Shear Resistance
Unlike many standard gap fillers, TFLEX P300 comes with a built-in polyimide film. This reinforcement layer offers exceptional dielectric strength, tear resistance, and protection against burrs or sharp edges—a common challenge in rugged environments like automotive or aerospace systems.
Compliant for Low Contact Resistance
Its soft, conformable nature helps the material fill irregular gaps while minimizing contact resistance. This means better thermal performance across the interface, even with board-level height variations.
Built for Assembly Ease
The contrasting purple color allows for easy visual alignment, even when automated vision systems are used. Add to that its low silicone bleed, and you’ve got a material that won’t compromise downstream processes or sensitive electronics. TFLEX P300 is available one side tacky to aid in assembly. The polyimide side is not supposed to be removed during operation.
Options/Nomenclature:
TFLEX P320 (.020” thickness), TFLEX P330 (.030” thickness), TFLEX P340 (.040” thickness), TFLEX P350 (.050” thickness), TFLEX P360 (.060” thickness), TFLEX P370 (.070” thickness), TFLEX P380 (.080” thickness), TFLEX P390 (.090” thickness), TFLEX P3100 (.100” thickness), TFLEX P3110 (.110” thickness), TFLEX P3120 (.120” thickness), TFLEX P3130 (.130” thickness), TFLEX P3140 (.140” thickness), TFLEX P3150 (.150” thickness), TFLEX P3160 (.160” thickness), TFLEX P3170 (.170” thickness), TFLEX P3180 (.180” thickness), TFLEX P3190 (.190” thickness), TFLEX P3200 (.200” thickness)
How does TFLEX P300 Compare to Other Thermal Pads?
This thermal gap filler pad is designed to be very good for economy applications that need to have great electrical performance with a slight compromise on thermal conductivity. The polyimide carrier reduces flexibility, and wet-out a little bit.
Wide Operating Temperature Range
Rated from -40°C to 125°C, TFLEX P300 is suitable for everything from satellite electronics to high-performance gaming systems and beyond.
Ideal Applications for TFLEX P300
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Automotive Electronics: From ADAS modules to powertrain ECUs, and infotainment units, TFLEX P300 handles vibration, shear, and variable thermal loads with ease.
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Consumer Devices: In notebooks, tablets, and gaming systems, it provides thermal relief without adding assembly complexity.
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Telecom & Industrial: Used in routers, smart home hubs, and wireless infrastructure, it supports high uptime and performance.
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Aerospace & Defense: With its high shear tolerance and polyimide reinforcement, TFLEX P300 is an excellent candidate for drones, satellite systems, and mission-critical electronics.
Technical Specifications at a Glance of TFLEX P300
| Property | Value |
|---|---|
| Thermal Conductivity | 3.0 W/mK |
| Density | 3.10 g/cc |
| Operating Temperature | -40°C to 125°C |
| Dielectric Strength | Polyimide Film Liner |
| Outgassing (CVCM) | 0.050% |
| Outgassing (TML) | 0.200% |
| Shelf Life | 2 Years from Shipment |
| Color | Purple |
More Information on TFLEX P300
In a world where devices are shrinking and power densities are rising, TFLEX P300 offers a smart balance of thermal performance, mechanical durability, and assembly ease. Its polyimide liner isn’t just a reinforcement—it’s a strategic advantage that makes it a reliable solution in high-shear, high-performance environments.
If you need a versatile gap filler that’s as tough as it is thermally capable, TFLEX P300 deserves a spot on your BOM. For more information on thermally conductive gap fillers, contact sales@nedc.com.