GPUs with thermal gap filler, tflex hr6.5
TFLEX HR6.5: Laird/DuPont’s High Recovery 6.2 W/m-K Thermal Gap Filler for Vibration-Prone Applications
When managing heat in electronics, especially where vibration, shock, or rework is a concern, TFLEX HR6.5 from Laird / DuPont stands out as a premium thermal gap filler. With a thermal conductivity of 6.2 W/m-K, excellent mechanical resiliency, and low outgassing, it’s engineered for high-reliability environments such as power electronics, AI related systems, GPUs, telecom, and automotive systems.
What is TFLEX HR6.5?
TFLEX HR6.5 is a ceramic-filled silicone thermal interface material (TIM) designed to fill air gaps between heat-generating components and heat sinks or chassis, thereby reducing thermal resistance. Unlike conventional gap fillers, TFLEX HR6.5 combines high thermal conductivity with high recovery properties, ensuring sustained performance even after compression and rework cycles.
Core Specifications of TFLEX HR6.5
| Property | Value |
|---|---|
| Thermal Conductivity | 6.2 W/m-K (Hot Disk) |
| Hardness | 50 Shore 00 (ASTM D2240) |
| Density | 3.2 g/cc |
| Thermal Resistance @ 1mm, 10 psi | 0.24°C-in²/W |
| Operating Temperature | -50°C to 150°C |
| Dielectric Strength | >7kV/mm (ASTM 149) |
| Outgassing TML / CVCM | 0.31% / 0.06% (ASTM E595) |
| Volume Resistivity | >1.1 x 10¹⁴ Ω·cm |
| UL Flammability | UL 94 V-0 |
| Color | Grey |
| Thickness Range | 0.040″ to 0.196″ (1mm – 5mm) |
| Standard Sheet Size | 18″ x 18″ or 9″ x 9″ |
| Carrier | None – for maximum compliance |
Key Performance Benefits of TFLEX HR6.5
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High Recovery & Reworkability: The elastomeric matrix allows TFLEX HR6.5 to rebound after pressure is removed, making it ideal for assemblies subject to rework or repeated mechanical stresses.
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Vibration & Shock Resilience: Designed to handle cyclic gap variations, TFLEX HR6.5 maintains thermal and mechanical integrity under vibration, shock, and warpage.
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Low Compression Force: Its soft, featuring 50 Shore 00 hardness minimizes stress on delicate components, enabling better material conformity without damaging PCBs or packages.
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Low Outgassing: Critical for aerospace, defense, and vacuum-sensitive applications, with TML of 0.31% and CVCM of 0.06%, per ASTM E595.
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Superior Electrical Isolation: Provides >7kV/mm dielectric breakdown voltage, ensuring both thermal and electrical isolation in high-voltage environments.
Application Suitability
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Power electronics and modules
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Automotive ECUs. and battery management systems
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Telecom and networking infrastructure
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Industrial automation
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Aerospace electronics
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LED lighting systems
- GPUs, and other AI related systems
Customization Options
TFLEX HR6.5 is available in:
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Thicknesses from 1mm to 5mm in 0.25mm increments
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Standard sheets (18” x 18”, 9” x 9”) or custom die-cut parts
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Optional DC1 surface coating for enhanced tack and assembly ease
Why Choose TFLEX HR6.5 for Your Thermal Management Needs?
If you need a highly thermally conductive gap filler that can withstand the rigors of assembly rework, mechanical stress, and harsh operating environments, TFLEX HR6.5 is a proven solution. Its blend of thermal performance, mechanical resilience, and electrical safety makes it a top choice for mission-critical electronics.
For more questions on thermal gap fillers, or you have an application that you feel could utilize TFLEX HR6.5 please contact sales@nedc.com.