Unveiling Tflex HP34: Next-Gen Thermal Gap Filler for Modern Electronics
What Is Tflex HP34?
Tflex HP34 is an advanced, silicone-free thermal gap filler developed by Laird Technologies. It features aligned graphite fibers, and boasts a remarkable bulk thermal conductivity of 34 W/mK, striking a perfect balance between softness and high thermal performance.
Key Features & Benefits
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High Thermal Conductivity (34 W/mK): Ensures rapid heat transfer across interfaces.
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Silicone-Free, Graphite-Based Composition: Minimizes oil bleed and avoids contamination issues common with traditional silicone pads.
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Maintains Performance Under Pressure: Optimized to perform best under 10–30 psi operating pressure, common in electronic assemblies.
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Soft with Excellent Deflection: Offers a compliant interface that adapts to surface irregularities while minimizing thermal resistance.
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Naturally Tacky: Mounts easily without additional adhesives.
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Wide Temperature Range: Operates effectively from –40 °C to +125 °C.
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Environmental Safety & Compliance: Meets RoHS & REACH standards, with low outgassing—making it safe for sensitive electronics.
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UL 94 V-0 Flammability Rating: Pending certification—adds a layer of fire safety.
Ideal Thicknesses & Sizes for TFLEX HP34
Available in thicknesses ranging from 1 mm to 5 mm, with ±10% tolerance. Standard sheets measure 127 mm × 76 mm (3″ × 5″), and custom die cuts are also an option.
Typical Thermal Resistance (At 10–50 psi)
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At 10 psi: 0.106–0.212 °C·in²/W
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At 30 psi: 0.059–0.185 °C·in²/W
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At 50 psi: 0.048–0.110 °C·in²/W
These values underscore Tflex HP34’s efficiency across a range of compressive loads.
Application Scenarios for TFLEX HP34
Tflex HP34 is tailored for applications where efficient thermal management and soft compliance are vital, such as:
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5G Base Stations & Telecom Infrastructure
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Servers, Datacom, and Networking Equipment
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Aerospace & Defense Electronics
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Automotive Modules (e.g., ADAS, infotainment)
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Consumer Electronics (notebooks, tablets, smart home devices)
More Information on TFLEX HP34
Tflex HP34 is a standout thermal gap filler solution, combining superior heat transfer, pressure resilience, material safety, and ease of use. Its graphite-based, silicone-free design makes it especially compelling for advanced electronics where performance and reliability are non-negotiable. For more information on TFLEX, or a thermal gap filler please contact sales@nedc.com.