Laird TFLEX HD80000 vs. TFLEX HD90000: Technical Comparison of High-Deflection Thermal Gap Fillers

Efficient thermal management is a critical design challenge as electronic devices become smaller, hotter, and more power-dense. Thermal gap fillers bridge uneven surfaces between heat-generating components and heatsinks, improving thermal transfer while protecting sensitive assemblies. Laird’s TFLEX HD80000 and TFLEX HD90000 are two leading solutions, engineered for high deflection at low pressure, reducing mechanical stress on printed circuit boards (PCBs), BGAs, and surface-mounted devices.

Technical Overview: TFLEX HD80000

The TFLEX HD80000 is a ceramic-filled silicone elastomer designed for thermal interface applications requiring both soft compliance and high reliability.

Key Properties:

• Thermal Conductivity: 6.0 W/m·K

• Compression Deflection: Low psi required for 25–50% deflection, minimizing board strain

• Dielectric Strength: >4 kV/mm, ensuring electrical isolation where required

• Operating Temperature: –40 °C to +150 °C

• Density: ~3.3 g/cc

• Thickness Range: 1.0 – 5.0 mm

• Shore Hardness (00 Scale): Very low, optimized for stress-sensitive components

• Outgassing: TML ~0.3%, CVCM ~0.04%

Applications: Automotive control modules, telecom boards, power supplies, and other systems where component fragility demands reduced mounting pressure but continuous thermal conductivity is essential.

Technical Overview: TFLEX HD90000

The TFLEX HD90000 builds on the same design principles but with enhanced conductivity and lower thermal resistance, making it one of the most high-performance thermal pads in its class.

Key Properties:

• Thermal Conductivity: 7.5 W/m·K

• Thermal Resistance: ~0.198 °C·in²/W at 40 mils, 10 psi, 50 °C

• Compression Deflection: Maintains integrity at low forces, excellent wet-out characteristics

• Operating Temperature: –50 °C to +125 °C

• Density: ~3.5 g/cc

• Thickness Range: 0.5 – 5.0 mm

• Outgassing: TML ~0.17%, CVCM ~0.01% (critical for aerospace and optical assemblies)

• Color: Grey for easy product differentiation

Applications: High-power GPUs, ASICs, memory modules, and telecom infrastructure, where maximum heat spreading is needed without sacrificing compliance.

Comparative Analysis: HD80000 vs. HD90000

Why High-Deflection Pads Are Critical

In conventional designs, rigid gap pads require 50–100 psi to achieve adequate wet-out, introducing risks:

• PCB warpage and cracked solder joints

• Mechanical stress on fragile IC packages

• Long-term reliability issues

The TFLEX HD80000 and HD90000 solve this by compressing effectively at <20 psi, maintaining thermal contact under minimal force. Their ceramic-filled matrix ensures consistent thermal conductivity without filler pump-out, even under thermal cycling.

Industry Applications

Both pads are widely deployed in:

• Data Centers: Cooling processors, ASICs, and memory in AI and cloud servers

• Automotive Electronics: Power inverters, ADAS modules, and EV battery systems.

• Telecom: Base stations, RF amplifiers, and networking hardware

• Aerospace & Defense: Avionics, radar, and systems where low outgassing thermal pads are mandatory

• Consumer Electronics: High-density notebooks, tablets, and gaming systems

Conclusion: Which Should You Choose?

• TFLEX HD80000 → Best suited for environments requiring high operating temperature tolerance (+150 °C) and extreme compliance for fragile boards.

• TFLEX HD90000 → The go-to choice when maximum thermal conductivity (7.5 W/m·K) and ultra-low outgassing are priorities, especially in aerospace, GPU cooling, and high-density servers.

Both are excellent thermal gap filler pads — the choice depends on whether your application values temperature stability (HD80000) or raw thermal performance (HD90000). NEDC does custom die cutting for customers.