Heat is the enemy of performance in modern electronics. As chips push higher wattages into smaller packages, the thermal interface material between the silicon and the heatsink becomes one of the most critical components in the entire system. The T-work9000 thermal pad from LiPOLY represents the upper boundary of what a soft thermal gap filler can achieve. With a thermal conductivity rating of 20.0 W/m·K and a thermal impedance of just 0.110 °C-in²/W at 10 psi, it sits at the top of the Extreme Series and is built for the most demanding thermal challenges in commercial electronics.
This post breaks down what makes the T-work9000 different, where it is used, and how NEDC converts it into custom-configured parts for production.
T-work9000 Specifications and Performance Data
The T-work9000 is a silicone-based, non-flammable thermal gap filler rated at 20.0 W/m·K (ISO 22007-2, ASTM D5470). That is a substantial jump from the 11.0 W/m·K of the T-work7000 and the 15.0 W/m·K of the T-work8000, and it places the T-work9000 in the same class as some of the highest-performing thermal interface materials available for commercial purchase.
The standout figure is the thermal impedance of 0.110 °C-in²/W at 10 psi. Most thermal pads are rated for impedance at 50 or 100 psi. At 10 psi, the T-work9000 achieves a lower impedance than many competitors achieve at five times that pressure. That matters in applications where component fragility or limited clamping features prevent high bolt-down forces.
Full specification summary:
- Thermal conductivity: 20.0 W/m·K
- Thermal impedance: 0.110 °C-in²/W @ 10 psi
- Color: Brown (visual identification)
- Surface tack: 2-side or 1-side options
- Thickness: Custom die-cut to specification
- Operating temperature range: -60°C to 150°C
- Density: 3.3 g/cm³ (ASTM D792)
- Hardness: 65 Shore OOO (ASTM D2240)
- Total mass loss (TML): < 0.1%
- Electrical insulation: Excellent
- ROHS / REACH / UL compliant
For complete technical specifications, download the T-work9000 datasheet (PDF).
The combination of ultra-high conductivity, ultra-low impedance, and Shore OOO softness makes the T-work9000 uniquely suited to applications where both thermal performance and surface conformability are non-negotiable.
Applications for the T-work9000
The T-work9000 targets high-heat-flux applications where lower-performing materials create thermal bottlenecks. Typical deployments include:
- AI accelerators and GPU modules where thermal design power exceeds 300W and heat density demands the best available interface
- 5G mmWave base station amplifiers with densely packed RF chains that generate concentrated heat loads
- High-end gaming hardware and compact workstations where thermals limit clock speed and longevity
- Electric vehicle power electronics including inverters and on-board chargers with sustained high thermal output
- Data center server nodes where per-rack power density is climbing past traditional air-cooling limits
- Aerospace and defense electronics where performance under thermal cycling must be proven to mission-critical standards
The T-work9000 is electrically insulating, which eliminates the need for a separate mica washer or polyimide film in most assemblies. That removes one interface layer from the thermal path, lowering total thermal resistance and simplifying the Bill of Materials.
How NEDC Converts T-work9000 for Production
The T-work9000 ships to NEDC in sheet form and gets converted into application-specific parts using die-cutting, waterjet cutting, and laser cutting depending on thickness and geometry requirements. The result is a ready-to-place component that fits the heatsink pocket, mounting location, or PCB feature exactly, with no on-site trimming needed.
NEDC supports:
- Custom die-cut parts to print or sample geometry
- Kiss-cut tape-and-reel for automated pick-and-place assembly
- Sheet supply for large-format or low-volume applications
- Rapid prototyping and quick-turn production runs
- Production volume with consistent quality and repeatability
The NEDC engineering team selects the appropriate thickness and tack configuration based on the gap depth, available clamping force, and thermal load of the target application. Contact NEDC early in the design phase to get a thermal analysis and material recommendation for your assembly.
Where the T-work9000 Fits in the Extreme Series
The LiPOLY Extreme Series includes three thermal pads that share a silicone platform, a non-flammable formulation, and a die-cut supply model through NEDC. Choosing between them comes down to the heat flux and thermal budget of the target application.
For more guidance on selecting the right Extreme Series product, see our overview of how thermal pads work and our guide to thermal gap filler pads.
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*Designing a high-thermal-load system and need to specify a T-work9000 part? Contact NEDC with your interface dimensions, gap range, and thermal load for a custom quote.*
is the enemy of performance in modern electronics. As chips push higher wattages into smaller packages, the thermal interface material between the silicon and the heatsink becomes one of the most critical components in the entire system. The T-work9000 thermal pad from LiPOLY represents the upper boundary of what a soft thermal gap filler can achieve. With a thermal conductivity rating of 20.0 W/m·K and a thermal impedance of just 0.110 °C-in²/W at 10 psi, it sits at the top of the Extreme Series and is built for the most demanding thermal challenges in commercial electronics.
This post breaks down what makes the T-work9000 different, where it is used, and how NEDC converts it into custom-configured parts for production.
T-work9000 Specifications and Performance Data
The T-work9000 is a silicone-based, non-flammable thermal gap filler rated at 20.0 W/m·K (ISO 22007-2, ASTM D5470). That is a substantial jump from the 11.0 W/m·K of the T-work7000 and the 15.0 W/m·K of the T-work8000, and it places the T-work9000 in the same class as some of the highest-performing thermal interface materials available for commercial purchase.
The standout figure is the thermal impedance of 0.110 °C-in²/W at 10 psi. Most thermal pads are rated for impedance at 50 or 100 psi. At 10 psi, the T-work9000 achieves a lower impedance than many competitors achieve at five times that pressure. That matters in applications where component fragility or limited clamping features prevent high bolt-down forces.
Full specification summary:
- Thermal conductivity: 20.0 W/m·K
- Thermal impedance: 0.110 °C-in²/W @ 10 psi
- Color: Brown (visual identification)
- Surface tack: 2-side or 1-side options
- Thickness: Custom die-cut to specification
- Operating temperature range: -60°C to 150°C
- Density: 3.3 g/cm³ (ASTM D792)
- Hardness: 65 Shore OOO (ASTM D2240)
- Total mass loss (TML): < 0.1%
- Electrical insulation: Excellent
- ROHS / REACH / UL compliant
For complete technical specifications, download the T-work9000 datasheet (PDF).
The combination of ultra-high conductivity, ultra-low impedance, and Shore OOO softness makes the T-work9000 uniquely suited to applications where both thermal performance and surface conformability are non-negotiable.
Applications for the T-work9000
The T-work9000 targets high-heat-flux applications where lower-performing materials create thermal bottlenecks. Typical deployments include:
- AI accelerators and GPU modules where thermal design power exceeds 300W and heat density demands the best available interface
- 5G mmWave base station amplifiers with densely packed RF chains that generate concentrated heat loads
- High-end gaming hardware and compact workstations where thermals limit clock speed and longevity
- Electric vehicle power electronics including inverters and on-board chargers with sustained high thermal output
- Data center server nodes where per-rack power density is climbing past traditional air-cooling limits
- Aerospace and defense electronics where performance under thermal cycling must be proven to mission-critical standards
The T-work9000 is electrically insulating, which eliminates the need for a separate mica washer or polyimide film in most assemblies. That removes one interface layer from the thermal path, lowering total thermal resistance and simplifying the Bill of Materials.
How NEDC Converts T-work9000 for Production
The T-work9000 ships to NEDC in sheet form and gets converted into application-specific parts using die-cutting, waterjet cutting, and laser cutting depending on thickness and geometry requirements. The result is a ready-to-place component that fits the heatsink pocket, mounting location, or PCB feature exactly, with no on-site trimming needed.
NEDC supports:
- Custom die-cut parts to print or sample geometry
- Kiss-cut tape-and-reel for automated pick-and-place assembly
- Sheet supply for large-format or low-volume applications
- Rapid prototyping and quick-turn production runs
- Production volume with consistent quality and repeatability
The NEDC engineering team selects the appropriate thickness and tack configuration based on the gap depth, available clamping force, and thermal load of the target application. Contact NEDC early in the design phase to get a thermal analysis and material recommendation for your assembly.
Where the T-work9000 Fits in the Extreme Series
The LiPOLY Extreme Series includes three thermal pads that share a silicone platform, a non-flammable formulation, and a die-cut supply model through NEDC. Choosing between them comes down to the heat flux and thermal budget of the target application.
For more guidance on selecting the right Extreme Series product, see our overview of how thermal pads work and our guide to thermal gap filler pads.
—
*Designing a high-thermal-load system and need to specify a T-work9000 part? Contact NEDC with your interface dimensions, gap range, and thermal load for a custom quote.*