LiPOLY’s T-top91-s sits at the top of the company’s Extreme Series thermal pad lineup, delivering an industry-leading thermal conductivity of up to 13.0 W/m·K. For systems that push complex computational workloads—5G infrastructure, high-end chips, high-speed mass storage—thermal interface resistance at the component-to-heatsink boundary becomes the limiting factor in sustained performance. The T-top91-s is engineered specifically to minimize that resistance, combining ultra-high conductivity with extremely low thermal impedance and a high compression rate that conforms to uneven surface topographies under modest mounting pressure.
The T-top91-s belongs to LiPOLY’s Extreme Series, the highest-performance tier in the company’s thermal pad family. At 13.0 W/m·K per ASTM D5470, it exceeds the conductivity of every other pad in the T-series, making it the go-to selection when thermal budgets are tight and conventional gap fillers cannot keep pace with the heat flux generated by advanced processors and RF power amplifiers.
T-top91-s Specifications
The T-top91-s is a gray-green, silicone-based thermal pad formulated for ultra-high thermal transfer across component-to-heatsink interfaces. Its thermal conductivity is rated at 13.0 W/m·K under ASTM D5470 and 8.0 W/m·K under ISO 22007-2, reflecting the two industry-standard test methodologies for through-plane thermal measurement. Thermal impedance is rated at 0.201 °C·in²/W at 10 psi, among the lowest figures available in a pre-cured pad. The material offers a high compression rate that allows it to fill gaps and surface irregularities without requiring excessive clamp force, and it maintains its dielectric properties across a wide operating range from -60°C to 150°C. Thickness is customized to the application per ASTM D374, and the pad is available with surface tack on one or both sides to accommodate different assembly workflows.
Typical properties:
- Thermal conductivity: 13.0 W/m·K (ASTM D5470), 8.0 W/m·K (ISO 22007-2)
- Thermal impedance: 0.201 °C·in²/W @ 10 psi
- Color: Gray Green
- Surface tack: 2-side / 1-side, option 2
- Thickness: Customized (ASTM D374)
- Density: 3.4 g/cm³ (ASTM D792)
- Hardness: 65 Shore OOO (ASTM D2240)
- Total Mass Loss (TML): <0.1%
- Application temperature: -60°C to 150°C
- Compliance: RoHS & REACH Compliant
Download the T-top91-s datasheet from LiPOLY
Applications Where T-top91-s Excels
The T-top91-s is specified wherever high heat flux must be conducted away from a heat-generating component into a heatsink or spreader with minimal interface resistance. Its combination of 13.0 W/m·K conductivity, low impedance, and high compressibility makes it well-suited to the following applications:
- Between CPU and heat sink — high-performance processors where sustained thermal transfer determines clock speed and longevity
- Between a component and heat sink — general-purpose interface for power semiconductors and discrete components
- Flat-panel displays — thermal management of backlight drivers and control electronics
- Power supplies — interface between power FETs, rectifiers, and chassis-mounted heat spreaders
- High-speed mass storage drives — SSD controllers and NAND packages operating at elevated throughput
- Telecommunication hardware — RF amplifiers and baseband processors in dense rack-mounted assemblies
- 5G base station & infrastructure — active antenna units and remote radio heads where thermal headroom is constrained
- High-end chips — AI accelerators, GPUs, and other advanced silicon with demanding thermal budgets
Beyond its thermal performance, the T-top91-s functions as an excellent electrical insulator. This dual role eliminates the need for a separate dielectric layer between live component surfaces and grounded heatsinks, simplifying assembly and reducing the number of materials in the thermal stack. The pad’s high compression rate allows it to maintain full surface contact even across components with slight planarity variation, ensuring consistent thermal transfer across the entire interface area.
T-top91-s and the LiPOLY Extreme Series
The T-top91-s is part of LiPOLY’s Extreme Series, the company’s highest-conductivity thermal pad family. The Extreme Series is engineered for applications where standard thermal pads cannot move heat fast enough to keep critical components within safe operating temperatures. Within this series, LiPOLY offers a range of conductivity tiers to match different thermal and cost requirements.
For systems requiring slightly lower conductivity, the T-work9000 provides a strong balance of thermal performance and compressibility. The T-work8000 offers mid-range conductivity suited to a broad set of consumer and industrial applications, while the T-work7000 serves as an entry point into the Extreme Series for less thermally demanding designs. The T-top91-s occupies the top of this range at 13.0 W/m·K, selected when every fraction of a degree at the interface matters.
Custom Die-Cut Supply Through NEDC
NEDC is an authorized converter of LiPOLY thermal products, supplying the T-top91-s as custom die-cut parts or in sheet form to customer specification. Die-cut parts are produced to exact component footprints, eliminating material waste and ensuring consistent placement during assembly. NEDC offers the T-top91-s in custom thicknesses per the application requirement and can apply tack to one or both sides as needed for the assembly process. Parts can be supplied on rolls or in sheets depending on volume and handling requirements. NEDC also provides additional LiPOLY thermal interface materials and can recommend the appropriate pad for a given thermal budget.
For more information on available thermal interface materials, see NEDC’s thermal pads page.
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Need a custom T-top91-s die-cut part? Contact NEDC with your specifications.