thermal pad application for GPU in datacenter
thermal pad application for GPU in datacenter
T-Putty™ 502: Closing the Thermal Gap in AI Hardware
AI workloads are driving unprecedented demand on hardware. Training and inference systems pack enormous compute power into ever-denser footprints, pushing GPUs, AI accelerators, and high-bandwidth memory (HBM) to the limits of their thermal envelopes. T-Putty™ 502 from Laird delivers the thermal conductivity and mechanical compliance needed to keep next-generation AI systems running at peak performance.
Optimized for High-Density Compute
In AI data centers, a single server can dissipate hundreds of watts per module. That heat needs to be efficiently transferred to cold plates, heat spreaders, or chassis without adding mechanical stress to delicate components. Thermal Gap Fillers are employed to help with this. T-Putty 502 solves this with:
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Thermal Conductivity: ~3.0 W/m·K to quickly move heat away from processors and memory.
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Conformable, Non-Curing Formulation: Fills surface gaps and irregularities for low thermal resistance.
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Minimal Assembly Stress: Protects sensitive packages like BGAs and stacked memory modules.
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Serviceability: Easy removal, and reapplication for system rework or upgrades.
Ideal AI Infrastructure Applications
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Thermal interfaces between cold plates and high-power GPUs, AI accelerators, or ASICs.
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Heat transfer for HBM modules in machine learning training clusters.
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Edge AI devices requiring reliable performance in variable environments.
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Industrial AI controllers where downtime must be minimized.
Performance Where it Counts
AI hardware operates best within strict temperature windows. Even small increases can force frequency throttling, lower training throughput, or shorten component life. T-Putty 502 helps prevent these drops by maintaining consistent thermal paths—ensuring the silicon can sustain maximum performance for longer cycles.
More Information/Die Cutting
As AI systems continue to grow in power density, the right thermal interface material isn’t just a support component—it’s a performance enabler. NEDC does die-cutting to make custom shaped pads. T-Putty™ 502 delivers the balance of conductivity, compliance, and reliability that tomorrow’s AI hardware demands.