When engineers talk about thermal pads, the conversation usually swings between thermal conductivity, softness, and electrical isolation. But there’s an increasingly important factor that gets overlooked until it becomes a problem: silicone contamination.

Some devices simply cannot tolerate silicone oils, outgassing, or bleed. Optics fog. Sensors drift. Switch contacts misbehave. Certain housings stain. And when that happens, even a great thermal pad becomes a liability.

That’s why T-Global’s TG-APC93 / PC93 exists — a fully non-silicone thermal interface pad designed for environments where silicone-based materials cause reliability issues.


What Makes PC93 Different? (Silicone-Free Matters)

Most thermal pads on the market are silicone-based. Silicone is easy to process, soft, conformable, and cheap — but it comes with side effects:

  • Oil bleed over time

  • Volatile siloxane outgassing

  • Surface contamination

  • Lens fogging in optical systems

  • Potential interference in switches, contacts, and sensors

PC93 eliminates all of that.

Because it’s silicone-free, it avoids the bleeding and outgassing behavior that can migrate onto nearby components. This gives you a cleaner assembly, predictable long-term stability, and full compatibility with optics, displays, cameras, sensors, and enclosed systems.

If your product has zero tolerance for contamination, PC93 becomes an easy “yes.”


Core Material Features

Here’s what the PC93 brings to the table:

  • Non-silicone formulation — no siloxanes, no oil bleed, no volatile silicone vapors.

  • Thermal conductivity ~2.1 W/m·K — enough for moderate power densities with a clean, predictable thermal path.

  • Very soft, conformable material — Shore 00 ~55, ideal for uneven surfaces and mechanical stack-up tolerances.

  • Thickness options from 0.5 mm to 5.0 mm — true gap-filling flexibility for housings, power modules, and PCB-to-sink bridges.

  • Excellent electrical insulation — safe for use directly against components and exposed traces.

  • Temperature range –30 °C to +125 °C — suitable for most industrial, telecom, consumer, and automotive environments.

You get the convenience of a gap-pad with the cleanliness of a silicone-free formulation.


Where PC93 Makes the Biggest Difference

Because it contains zero silicone, PC93 shines anywhere contamination would cost you performance, yield, or warranty headaches.

Best-fit applications:

  • Optical instruments (camera modules, sensors, vision systems)

  • Display housings and LED assemblies

  • Automotive electronics (interior modules, ADAS sensors, infotainment units)

  • High-reliability telecom/networking equipment

  • Medical and laboratory equipment

  • Any sealed enclosure where silicone outgassing is unacceptable – to be clear outgassing still happens just not silicone because there is simply no silicone in this formulation.

If your product is enclosed, high-precision, or sensitive to airborne contaminants, PC93 is built for it.


Pad vs. Paste — Why a Silicone-Free Pad Is the Safe Choice

Thermal paste can outperform pads in raw conductivity, but:

  • It’s messy

  • It ages

  • It pumps out under vibration

  • And if it’s silicone-based, the contamination risk becomes even worse

PC93 gives you:

  • Consistent thickness

  • Predictable thermal impedance

  • No mess during assembly or rework

  • No risk of silicone migration

  • Better long-term reliability in sensitive environments

You get cleanliness and repeatability, which is what most production environments really need.


Final Thoughts

The TG-APC93 / PC93 is a strong option when you need a soft, electrically insulating, gap-filling thermal pad without any silicone-related headaches. It’s designed for the growing category of electronics where cleanliness, reliability, and material purity matter just as much as thermal performance. NEDC die-cuts/waterjet cuts all sorts of thermal gap filler pads.

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