laptop, thermal pads
As power densities continue to rise across aerospace, defense, AI hardware, and advanced electronics, thermal interface materials must do more than simply conduct heat. They must conform, insulate electrically, maintain reliability over time, and perform under uneven surfaces and variable contact pressures.
Three ultra-soft thermal pads from T-Global Technology—TG-AD30, TG-AD66, and TG-AD75—are frequently evaluated together because they address the same design challenge from different performance levels. While each material stands on its own, they share a common philosophy: low thermal impedance, excellent compliance, and suitability for high-power applications.
A Shared Design Philosophy: Conformability Meets Performance
All three pads are classified as ultra-soft thermal pads, engineered to reduce interfacial resistance by conforming to component and heatsink irregularities. This makes them particularly effective where flatness is imperfect or where contact pressure must be minimized.
Across the three materials, designers will find:
-
High thermal conductivity relative to softness
-
Low thermal impedance under realistic contact pressures
-
Strong electrical insulation properties
-
UL 94 V-0 flame rating
-
Operating temperature range of -50 °C to +150 °C
-
Availability in sheet form and die-cut custom geometries
These shared attributes make the materials interchangeable from a mechanical and processing standpoint, while their thermal performance differentiates them for specific use cases.
TG-AD30: Ultra-Soft Compliance at 3.0 W/m·K
TG-AD30 offers a balanced entry point for ultra-soft thermal pads, delivering a thermal conductivity of 3.0 W/m·K.
With very low hardness, TG-AD30 is extremely conformable, making it well-suited for assemblies with delicate components or limited mounting force. It is commonly used where gap variation is significant and maintaining consistent contact is more critical than pushing maximum thermal transfer.
Typical applications include:
-
Power electronics with uneven stack-ups
-
Aerospace and defense electronics
-
LED and lighting assemblies
-
Industrial control hardware
TG-AD66: Higher Conductivity at 6.5 W/m·K with Controlled Softness
Stepping up in thermal performance, TG-AD66 provides a thermal conductivity of 6.5 W/m·K while maintaining an ultra-soft feel.
This material is often selected when heat flux increases but mechanical compliance is still required. TG-AD66 strikes a practical balance between heat transfer efficiency and ease of compression, making it a strong candidate for higher-power designs that cannot tolerate rigid interface materials.
Common use cases include:
-
AI and data-processing hardware
-
Automotive electronics and EV subsystems
-
Telecom and networking equipment
-
Energy storage and power conversion
TG-AD75: Maximum Ultra-Soft Performance at 7.5 W/m·K
At the top end of this performance range is TG-AD75, offering a thermal conductivity of 7.5 W/m·K.
Designed for applications where thermal margins are tight and reliability is paramount, TG-AD75 maintains low thermal impedance under pressure while still providing excellent electrical insulation. It is well-suited for demanding environments where both compliance and heat dissipation are critical.
It is frequently specified for:
-
High-power AI accelerators and servers
-
Aerospace and military electronics
-
Advanced medical and imaging systems
-
Mission-critical power electronics
Datasheet Download for TG-AD75
Choosing Between TG-AD30, TG-AD66, and TG-AD75
While these materials are often evaluated together, selection typically comes down to thermal load, allowable pressure, and surface flatness:
-
TG-AD30 (3.0 W/m·K) favors maximum compliance and gentler contact
-
TG-AD66 (6.5 W/m·K) balances conductivity and softness for higher power
-
TG-AD75 (7.5 W/m·K) prioritizes thermal performance without sacrificing conformability
Because all three are available in multiple thicknesses and can be precision die-cut, designers can maintain consistent assembly processes while tuning thermal performance as requirements evolve.
How New England Die Cutting Supports These Materials
New England Die Cutting (NEDC) supplies TG-AD30, TG-AD66, and TG-AD75 in custom-cut formats to match exact customer prints, tolerances, and production volumes. Whether the requirement is prototype quantities or repeat aerospace and defense programs, NEDC supports:
-
Precision die-cut and waterjet processing
-
Custom thickness selection
-
Tight dimensional control
-
Documentation and traceability for regulated industries
If you’re evaluating ultra-soft thermal pads for high-power electronics and want guidance on material selection or cut geometry, NEDC can help translate datasheet performance into real-world results.