At NEDC, we cut a whole bunch of different types of thermal pad gap filling materials. Sil-Pad 980 has a unique application list where it’s used.
Properties of SIL PAD TSP 1680, aka Sil-Pad 980
SIL PAD TSP 1680 has great cut-through resistance. It is silicone-based with a fiberglass carrier. This fiberglass carrier is critical for the high pressure applications where screw-mounting is necessary- similar to other thin Sil-Pad products. Sil-Pad 980 is part of the Sil-Pad family, so pressure is critical to extracting good thermal performance from this pad. Some properties of Sil-Pad 980 are below:
-Shore Hardness of 95A durometer
-Thermal Conductivity of 1.2 W/m-K
-Good Dielectric Breakdown of 4,000 Vac
-Excellent Heat Transfer
Applications for BERGQUIST SIL PAD TSP 1680
-Silicone sensitive applications, such as bonding applications
-Telecommunications such as 5G networks
-Automotive electronics such as smart cars
NEDC is a thermal pad manufacturer/supplier. The thickness available for this Sil-Pad is .009’’ This material comes in a mauve (purple/violet) color. NEDC die-cuts or otherwise converts Sil-Pad 980 into custom shapes. For more information on thermal gap filling materials, or you feel you have an application that could utilize Sil-Pad 980 aka SIL PAD TSP 1680, please contact email@example.com.