COOLSPAN® TECA Epoxy Film
NEDC laser-cuts many materials with its laser-cutting machines. One of the most frequently cut materials at NEDC is frozen epoxy films. Many of these film materials offer thermal and/or electrical conductivity. COOLSPAN® TECA from Rogers Corporation is a thermally and electrically conductive silver-filled frozen epoxy film that is used for permanent bonding of circuit boards to heatsinks.
What is COOLSPAN® TECA Adhesive Film?
This thermosetting film is a silver filled epoxy bonding film. It is commonly laser-cut into epoxy preforms for customers to provide an ease of bond in their application. This adhesive-film allows for a consistent bond-line across the application. This compares to other adhesives that may cause air-gaps or otherwise inconsistent bonds that may ultimately not perform well. This clean, neat film cut into a preform can provide a clean solution to permanent bonds for RF module housings. These preforms can be especially helpful when many cut-outs, and features make for a crowded bond line. This film features a thermal conductivity of 6 W/m°C, and an extremely low volume resistivity of .00038 ohms-cm. This extremely low volume resistivity is used for EMI shielding, and the high thermal conductivity helps manage the increasing heat requirements that in electronic assemblies. This film features great chemical resistance, and fantastic high temperature performance. COOLSPAN® TECA is intended to be a permanent bond once bonded in the application. Ways of cutting COOLSPAN® TECA are numerous. However, NEDC has found that best results seem to come from die-cutting, and laser-cutting.
How are these Adhesive Epoxy Preforms Stored?
These epoxy preforms are stored in refrigeration temperatures. In addition, they are shipped on what we call “blue ice” or essentially freeze packs.
Can this Epoxy Preforms be Cut to Allow for Pretack?
COOLSPAN® TECA can be cut to their liner to allow for pretack bonding before full bonding to occur. The pretacking is important to prevent the adhesive from becoming an adhesive mess before the bonding can occur.
Why Chose COOLSPAN® TECA Over Competitive Adhesive Electronic Films?
Customers we deal with like COOLSPAN® TECA for a few reasons.
1. It has a low flow under pressure when curing. This is important because the dimensions that the adhesive preform is cut to is similiar to the finished dimensions.
2. It has a number of sheet sizes that are available for customers allowing different preform sizes.
3. COOLSPAN® TECA can be provided die-cut, or laser-cut in convenient sizes for electrical assemblies.
circuit card assembly
circuit card assembly
More Information- Availability/Shelf Life of COOLSPAN® TECA
This material has a 12 month shelf life from Date of Manufacture. COOLSPAN® TECA film is available in .002’’, and .004’’ in thickness. Sheets are held within +/- .0005’’ in order to ensure a uniform bond line. It comes in a number of sheet sizes, so it is best to inquire for bigger size preforms. COOLSPAN® TECA has a dull tan color. NEDC is a major supplier of laser-cut adhesive film products. For more information on COOLSPAN® TECA, or you believe you have an application that could utilize COOLSPAN® TECA film, please contact sales@nedc.com.