Not every thermal interface application demands the highest conductivity on the market. Many designs need a reliable, well-balanced thermal pad that delivers solid heat transfer across a broad range of operating conditions, without the cost premium of ultra-high-performance materials. The PK605 thermal pad from LiPOLY is engineered for exactly that space — a General Series gap filler that brings 6.0 W/m·K of thermal conductivity to applications spanning consumer electronics, automotive systems, and telecommunications infrastructure.
The PK605 sits in LiPOLY’s General Series, a family of thermal gap fillers built for volume production and broad applicability. It delivers 6.0 W/m·K of thermal conductivity (ASTM D5470) in a formulation that emphasizes low thermal impedance, natural surface tack for easy assembly, and availability across a range of custom thicknesses. That combination makes it a practical choice for engineers who need consistent thermal performance without over-specifying the material.
PK605 Specifications
The PK605 is a silicone-based thermal gap filler rated at 6.0 W/m·K (ASTM D5470). The thermal impedance figures tell the rest of the story: 0.371 °C-in²/W at 10 psi and 0.262 °C-in²/W at 50 psi of contact pressure. The drop in impedance between 10 and 50 psi reflects the material’s ability to compress and conform to surface irregularities as mounting force increases, improving wet-out against mating surfaces. That behavior matters in assemblies where the available clamping pressure varies across the interface — the PK605 compensates by filling gaps more completely as pressure rises.
The material has a hardness of 60 Shore OO (ASTM D2240), which places it in the compliant pad category. That softness allows it to conform to surface irregularities and handle coplanarity issues in multi-component thermal assemblies. Natural surface tack — available in 2-side or 1-side configurations — holds the pad in position during assembly without requiring adhesive carriers that could add thermal resistance.
Typical properties:
- Thermal conductivity: 6.0 W/m·K (ASTM D5470)
- Thermal impedance: 0.371 °C-in²/W @ 10 psi, 0.262 °C-in²/W @ 50 psi
- Color: Red
- Surface tack: 2-side or 1-side (option 2)
- Thickness: Customized (ASTM D374)
- Density: 3.2 g/cm³ (ASTM D792)
- Hardness: 60 Shore OO (ASTM D2240)
- Operating temperature: -60°C to 180°C
- Dielectric breakdown: 12 KV/mm (ASTM D149)
- ROHS / REACH compliant
For complete technical specifications, visit the PK605 product page on LiPOLY.
Applications Where PK605 Excels
The 6.0 W/m·K conductivity rating places the PK605 in the mid-range of LiPOLY’s thermal pad lineup, suitable for a wide variety of electronic assemblies where moderate heat density requires a dedicated thermal interface material:
- Notebook computers where CPU and GPU heat must transfer to the chassis or heat pipe assembly
- Heat pipe assemblies that require a compliant interface between the pipe and the heat-generating component
- Memory modules in servers and embedded systems requiring consistent thermal contact across multiple chips
- TV hardware where backlight drivers and power stages need steady heat dissipation
- Automotive electronic devices operating across wide temperature swings and vibration environments
- Mobile devices where thin profiles and tight gaps demand a conformable pad
- High-speed mass storage drives where controller ICs benefit from direct thermal coupling to the enclosure
- Set-top boxes and streaming hardware with sustained processing loads
- IP cameras requiring reliable thermal management in compact, sealed enclosures
- 5G base station and infrastructure equipment with continuous high-power operation
- EV electric vehicle systems including battery management and power conversion modules
The PK605 also provides reliable electrical insulation, with a dielectric breakdown rating of 12 KV/mm (ASTM D149). That dielectric strength allows the pad to isolate electrically live components from grounded heatsinks, eliminating the need for a separate insulating layer in the thermal stack. The wide operating temperature range of -60°C to 180°C covers the full spectrum from cold-soaked automotive electronics to high-temperature industrial environments.
PK605 and the LiPOLY General Series
The PK605 is part of LiPOLY’s General Series, a family of thermal gap fillers designed for broad applicability across consumer, industrial, and automotive electronics. The General Series prioritizes a balance of thermal performance, conformability, and cost-effectiveness — making it the go-to choice for volume production where the Extreme Series’ higher conductivity is not required.
Within the PK series, the PK605 occupies a mid-range position. For higher thermal loads, LiPOLY offers the PK700, which steps up thermal conductivity while maintaining the same silicone-based platform. For applications where 6.0 W/m·K exceeds the requirement, the PK504 provides a lower-conductivity alternative at a reduced cost point. This progression within the series lets engineers scale thermal performance up or down while maintaining the same material family, die-cut geometry, and supplier process — simplifying qualification and keeping the supply chain predictable.
For designs that require significantly higher thermal conductivity, LiPOLY’s Extreme Series offers stepped-up alternatives. The T-work7000 delivers 11.0 W/m·K, the T-work8000 reaches 15.0 W/m·K, and the T-work9000 tops out at 20.0 W/m·K for the most demanding applications.
Custom Die-Cut Supply Through NEDC
NEDC converts PK605 into custom-configured parts using die-cutting, waterjet cutting, and laser cutting, depending on the material thickness and geometry requirements. The pad arrives at your production line as a ready-to-place part, sized to the housing, PCB feature, or heatsink pocket it was designed for — no secondary cutting, trimming, or hand fitting required.
The PK605 is available in roll form, sheet form, and as die-cut parts, which gives production teams flexibility in how the material is handled and placed. Kiss-cut tape-and-reel formats are also available for automated pick-and-place assembly. NEDC’s engineering team can advise on optimal thickness selection based on the available gap, clamping force, and surface tack configuration needed for the assembly.
For a complete overview of NEDC’s thermal pad offerings, visit the NEDC thermal pads page.
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*Need a custom PK605 die-cut part? Contact NEDC with your specifications.*