Modern electronics run hotter and denser than ever. Heat must move efficiently from chips, power modules, and GPUs into heat sinks or chassis. Air gaps and surface roughness create thermal bottlenecks; thermal grease can migrate or pump out over time.
Phase Change Materials (PCMs) provide a clean, reliable solution. They remain solid at room temperature for easy assembly, then soften when heated to form an ultra-thin, low-resistance thermal interface. Laird’s Tpcm™ line is engineered for stable performance, long life, and ease of use.
Tpcm™ 7000 — Ultra-Low Thermal Resistance for Extreme Loads
-
Thermal conductivity: 7.5 W/m·K
-
Bondline thickness: as low as 25 µm once activated
-
Operating range: –40 °C to 125 °C
-
Highlights: non-silicone, naturally tacky, no pump-out, RoHS/REACH compliant
Tpcm 7000 softens around 50 °C and fully wets surfaces, displacing air pockets for minimal thermal resistance — as low as 0.06 °C-cm²/W at 50 psi. Designed for GPUs, power modules, servers, automotive electronics, and other ultra-demanding heat loads. .125mm, .200mm, .250mm, and .400mm.
Tpcm™ 780 — Silicone-Free, Ultra-Soft & Easy to Rework
-
Thermal conductivity: 5.4 W/m·K
-
Softening range: ~45 °C to 70 °C
-
Operating range: –40 °C to 125 °C
-
Highlights: inherently tacky, no adhesives needed, minimal pump-out, UL V-0
Tpcm 780 is very soft at room temperature — reducing board stress — and ideal for processors, graphics cards, notebooks, and servers. Its polymer matrix keeps it stable and clean even after long thermal cycling. Thicknesses available .13mm, .20mm, .25mm, .40mm, .64mm.
Tpcm™ AL52 — Clean Aluminum-Foil Backed PCM
-
Thermal conductivity: 2.0 W/m·K
-
Melting point: ~52 °C
-
Operating range: –40 °C to 125 °C
-
Highlights: aluminum foil core for heat spreading and easy handling, no pump-out, cost-effective
AL52 acts like a grease replacement but without mess. It comes pre-coated on aluminum foil, so installers can pick, place, and mount cleanly. Available with or without adhesive, in sheets, rolls, or die cuts. Thicknesses available .075mm.
Tpcm™ 5000 — Balanced Cost & Performance
-
Thermal conductivity: 5.3 W/m·K
-
Softening range: 50 °C to 70 °C
-
Bondline thickness: down to 25 µm
-
Operating range: –40 °C to 125 °C
-
Highlights: cost-optimized, non-silicone, reliable under 1000-hour aging tests
For many applications, 5000 hits the sweet spot — low thermal resistance, stable performance, and competitive cost. Suited for semiconductor packaging, automotive ECUs, and game consoles. Thicknesses available .125mm, .200mm, .250mm, .400mm.
Application & Integration Tips
-
Choose minimal thickness — Laird offers each PCM in multiple thicknesses (often 0.125 mm to 0.400 mm) to optimize resistance vs. gap tolerance.
-
Burn-in when required — some grades need a brief heat soak under pressure to reach full wet-out.
-
Surface prep — clean, flat contact improves performance.
-
Storage & handling — keep sealed at room conditions; most have one-year shelf life unopened.
Why Phase Change Beats Grease
-
Cleaner assembly — no smearing or cleanup.
-
Stable over life — minimal pump-out and migration.
-
Consistent performance — predictable bondline thickness and thermal impedance.
Ready for Custom Die-Cutting
All four Tpcm materials are available in sheets, rolls, or fully die-cut and kiss-cut parts for easy drop-in assembly. That means you can spec a thermal pad that fits your PCB footprint exactly, including cutouts for screws, standoffs, or components.