Most thermal pad content online targets individual consumers buying retail pads. But for engineers designing graphics cards, building GPU cooling assemblies, or sourcing thermal pads for production runs, the requirements are fundamentally different. The application requires custom-cut parts in specific shapes, consistent tolerances, and material documentation for quality records.
NEDC die-cuts thermal pads for graphics card manufacturers, GPU cooler designers, and electronics assembly companies. This guide covers what engineers and procurement teams need to know when sourcing custom thermal pads for production.
Material Brands Available for Graphics Card Thermal Pads
NEDC die-cuts thermal pad materials from the following manufacturers:
- Henkel Bergquist — Gap Pad TGP series, THERM-A-GAP pads, Sil-Pads
- Laird/DuPont — TFLEX gap fillers, TFLEX SF silicone-free series, CoolZorb hybrid absorbers
- Parker Chomerics — CHO-THERM silicone and non-silicone insulators, CHO-THERM HV series
- T-Global Technology — TG-A series gap fillers, TG-APC non-silicone pads
- FujiPoly — Sarcon thermal interface pads
- Saint-Gobain — ThermaCool thermal interface products
Each manufacturer offers materials at different conductivity levels, thicknesses, and with different properties (silicone vs silicone-free, reinforced vs unreinforced, adhesive-backed vs tack-only). We can help you select the right material based on thermal requirements.
Die-Cutting Graphics Card Thermal Pads
Die-cutting is the most efficient method for producing thermal pads in consistent shapes at production volumes. NEDC uses steel-rule dies to cut thermal pad materials into finished parts with:
- Tight dimensional tolerances (see our guide on tolerancing for thermal pads)
- Complex geometries that match GPU VRAM layouts and VRM patterns
- Clean edges without the deformation that manual cutting causes
- PSA backing application for self-adhesive parts
For a deeper look at why die-cutting is the best method, see our post on die-cutting thermal pads.
Prototyping to Production
NEDC supports the full development cycle. For customers still in the prototyping phase, NEDC produces sample parts quickly from drawings or samples. Our rapid prototyping capabilities allow you to test multiple materials and thicknesses before committing to a production die.
Once the design is finalized, we move to production die-cutting with steel-rule dies for repeatable, consistent parts at volume.
Specifying Graphics Card Thermal Pads for a Production Order
When requesting a quote for custom graphics card thermal pads, have the following information ready:
- Material specification — manufacturer and product line (e.g., Bergquist Gap Pad 5000S35), or performance requirements (W/mK, thickness, silicone-free)
- Part dimensions — length, width, and thickness for each part
- Quantity — annual usage and order quantity
- PSA requirements — adhesive-backed, natural tack, or no adhesive
- Format — individual parts, kiss-cut on a liner, or sheet form
- Tolerance requirements — standard or tight tolerance (see our tolerancing guide)
Kiss-Cut Thermal Pad Kits for Assembly
For graphics card assembly lines, kiss-cut thermal pad kits improve assembly speed and reduce handling damage. Kiss-cut parts are cut through the material but not through the backing liner, so operators can peel and place each pad quickly without touching the thermal interface surface.
This format is especially useful for graphics card assembly where multiple pad shapes (core pad, VRAM pads, VRM pads) must be installed in sequence.
Getting Started
Whether the customer provides drawings, samples, or just a material spec and dimensions, request a quote and our team will provide pricing, lead time, and material recommendations. We stock materials from all major thermal pad manufacturers and can typically turn prototype parts within a few days.