Henkel/Bergquist Gap Pad® 6000ULM vs. 7000ULM: Choosing the Right Thermal Interface Material
When high-power electronics generate significant heat, choosing the right thermal interface material (TIM) is critical. Henkel/Bergquist’s Gap Pad® ULM series offers ultra-low modulus, conformable gap fillers that provide excellent thermal performance at low compression stress. Two of the most popular options are TGP 6000ULM and TGP 7000ULM. While they share many similarities, there are important distinctions that can help engineers select the right material for their application.
At NEDC, we convert both materials into custom die-cut shapes, ensuring they integrate seamlessly into your assemblies.
Gap Pad TGP 6000ULM
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Thermal Conductivity: 6.0 W/m-K
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Appearance: Gray
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Reinforcement: Fiberglass carrier for added stability
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Thickness Range: 1.016 to 3.175 mm (0.040″ to 0.125″)
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Hardness: Shore 000 ~60
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Young’s Modulus: 41.3 kPa (≈6 psi) — very soft, highly conformable
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Surface Tack: High inherent tack on both sides; one side less tacky for easier handling
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Sheet Size: 8″ x 16″ — offers more material per sheet and easier part layout
Applications:
6000ULM is designed for telecommunications equipment, ASICs, DSPs, consumer electronics, and thermal modules. Its softness allows excellent wet-out on rough or uneven surfaces, while the fiberglass reinforcement and larger sheet size make it easier to handle, cut, and rework than many higher-performance options.
Part Numbers: GP6000ULM-0.040-02-0816, GP6000ULM-0.060-02-0816, GP6000ULM-0.080-02-0816, GP6000ULM-0.100-02-0816, GP6000ULM-0.125-02-0816
Gap Pad TGP 7000ULM
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Thermal Conductivity: 7.0 W/m-K
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Appearance: Gray
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Reinforcement: None specified; highly conformal material
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Thickness Range: 1.02 to 3.18 mm (0.040″ to 0.125″)
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Hardness: Shore 000 ~75
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Young’s Modulus: 152 kPa (≈22 psi) — still soft, but slightly firmer than 6000ULM
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Surface Tack: Naturally tacky on both sides with protective liners
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Sheet Size: 8″ x 8″ — smaller standard format
Applications:
7000ULM is formulated for telecom base stations, routers, switches, optical transceivers, and high-power processors (ASICs, DSPs). With higher conductivity and slightly firmer modulus, it excels in high-performance environments where every degree of thermal resistance reduction counts. The smaller sheet size can be a limiting factor for larger layouts, but it is still well-suited for precision applications.
Part#s: GP7000ULM-0.040-02-0808, GP7000ULM-0.060-02-0808, GP7000ULM-0.080-02-0808, GP7000ULM-0.100-02-0808, GP7000ULM-0.125-02-0808
Key Comparison: 6000ULM vs. 7000ULM
| Property | 6000ULM | 7000ULM |
|---|---|---|
| Thermal Conductivity | 6.0 W/m-K | 7.0 W/m-K |
| Hardness (Shore 000) | ~60 (softer) | ~75 (slightly firmer) |
| Young’s Modulus | 41.3 kPa (6 psi) | 152 kPa (22 psi) |
| Reinforcement | Fiberglass carrier | None specified |
| Thickness Range | 1.016–3.175 mm | 1.016–3.175 mm |
| Sheet Size | 8″ x 16″ | 8″ x 8″ |
| Handling | Easier, reinforced, larger | Smaller, higher performance |
Takeaway:
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6000ULM is softer, easier to handle, and available in larger sheet sizes — ideal for general high-performance electronics where ease of processing matters.
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7000ULM provides higher conductivity and better thermal performance, but with a slightly firmer modulus and smaller sheet size — best for the most demanding applications.
NEDC’s Role in Thermal Management
Both 6000ULM and 7000ULM are supplied in sheets, but in practice, customers need custom-sized pads to match their designs. At NEDC, we die cut pads into exact component shapes, eliminating hand-trimming and ensuring consistent, reliable fit for production.