At NEDC we cut many thermal pads. Highly demanding applications usually come with requirements of a high performance thermal pad. NEDC commonly die-cuts TIMs(thermal interface materials). Oftentimes, it can be difficult to find a good thermal pad match for your application. For applications that requires both great puncture resistance, and good thermal conductivity, finding a solution may be challenging. A unique thermal pad that offers a strong diversity of performance characteristics is Gap Pad A3000 thermal pad by Henkels’ Bergquist.
Gap Pad A3000 is a fiberglass reinforced pad with a silicone rubber binder. The fiberglass reinforcement provides excellent handling ability along with durability. As with most thermal pads, Gap Pad A3000 is also electrically isolating. It features tack on one side, that’s compares with heavy adhesives that can be thermally impeding. This tackiness is usually used to aid in assembly processes. As with most thermal pads available from Henkel’s Bergquist, it offers the prestigious UL 94 V0 flame rating. The temperature range of this thermal pad is -76° to 392° F. The thermal conductivity of this pad is an impressive 2.6 w/m-K. This is on the high-end of many thermal pads. More importantly, its thermal impedance features a low .68 (°C-in2 /W) at 30% deflection. With the combination of the tack one side and a great balance of properties it makes this thermal pad especially versatile. In addition, this combination makes it especially useful for certain applications. Some common applications of this thermal pad include heat pipe assemblies, between a CPU and a heat spreader, or telecommunications.
Gap Pad A3000 is also known as GAP PAD TGP A2600. This thermal pad has a distinct gold color. This thermal pad is available in sheets in a number of sizes, such as 8’’ x 16’’ or others. NEDC commonly die-cuts, and waterjet cuts this pad into unique shapes. For more information on this thermal pad, or you have an application that you think could utilize this pad, please contact email@example.com.