Gap Pad® 1450: Reworkable, Thermally Conductive Gap Filling Material

When working with sensitive electronics, thermal management materials must not only conduct heat efficiently but also accommodate design changes, component replacements, and field rework. Gap Pad® 1450 aka GAP PAD TGP 1350 from Bergquist was engineered with these requirements in mind. It delivers reliable thermal performance while maintaining structural integrity during rework cycles—a feature that sets it apart from many conventional gap fillers.

Why Reworkability Matters

In high-mix, low-volume builds—or in any environment where boards undergo engineering changes, testing, or repair—thermal pads are often removed and reapplied. Traditional gap fillers can tear, delaminate, or lose performance during rework.

Gap Pad® 1450 aka GAP PAD TGP 1350 addresses this by incorporating a permanent liner reinforcement. This embedded liner improves puncture resistance and tear strength, enabling the pad to withstand removal and reinstallation without degrading. The clear liner can even be removed on thicknesses above 60 mil if necessary, without significant impact on thermal conductivity.

This design provides engineers the ability to:

• Reposition thermal pads during initial assembly.

• Replace components without sacrificing thermal interface performance.

• Reduce scrap and material waste in rework-heavy environments.

Technical Performance Profile

Gap Pad® 1450 provides a balance of thermal efficiency, compliance, and electrical insulation:

• Thermal Conductivity: 1.3 W/m-K (ASTM D5470)

• Hardness: 30 Shore 00 (compliant for fragile leads)

• Young’s Modulus: 16 psi (110 kPa), extremely soft to minimize strain

• Dielectric Strength: >6000 Vac (ASTM D149)

• Operating Temperature: -60 °C to 150 °C

• Flame Rating: UL 94 V-0

Its low modulus and high conformability ensure effective wet-out on rough surfaces, while inherent tack on one side removes the need for additional adhesives that could impede heat transfer.

Applications Where Gap Pad® 1450 Excels

Gap Pad® 1450 aka GAP PAD TGP 1350 is particularly suited for environments requiring both compliance and reworkability:

• LED and Lighting Systems — where thermal pads may be replaced as arrays are upgraded.

• Computers and Peripherals — especially in prototypes or small production runs where designs evolve.

• Telecommunications Equipment — where boards see service rework and component swaps.

• General Semiconductor-to-Heatsink Interfaces — enabling reliable thermal transfer even after pad removal and replacement.

Availability

Gap Pad® 1450 aka GAP PAD TGP 1350 is available in sheet form and die-cut parts, with standard thicknesses from 0.020” (0.508 mm) to 0.125” (3.175 mm). Standard part numbers include:

• GP1450-0.020-01-0816

• GP1450-0.040-01-0816

• GP1450-0.060-01-0816

• GP1450-0.080-01-0816

• GP1450-0.100-01-0816

• GP1450-0.125-01-0816

Conclusion

Gap Pad® 1450 aka GAP PAD TGP 1350 is more than just a thermally conductive pad—it’s a reworkable solution that minimizes downtime, reduces waste, and supports iterative design. By pairing thermal conductivity of 1.3 W/m-K with liner reinforcement for durability, it ensures that thermal management doesn’t come at the expense of flexibility.

For engineers balancing thermal performance with practical manufacturing needs, Gap Pad® 1450 is a robust, field-ready choice.