Unleashing the Potential of LOCTITE® ABLESTIK ECF 3354: NEDC’s Preferred Adhesive Film
At NEDC, our commitment to offering cutting-edge solutions in thermal management and assembly drives us to provide products that perform beyond expectations. LOCTITE® ABLESTIK ECF 3354,is a brand new epoxy film adhesive that resets the standards in high performance bonding films. This product has become an essential part of our offerings, particularly for those seeking high-performance adhesive solutions for electrical, thermal, and mechanical applications. Here’s why this adhesive bonding film stands out in the market.
Exceptional Thermal Conductivity at 20 W/m-K
LOCTITE® ABLESTIK ECF 3354 boasts an industry-leading thermal conductivity of 20 W/m·K. This makes it a standout choice for applications requiring efficient heat transfer, particularly in environments where thermal management is critical. In fact, this is the HIGHEST thermal conductivity available in industry by a wide margin. From RF ground planes to other high-performance assemblies, this product ensures superior thermal dissipation, safeguarding sensitive electronic components from overheating.
Reliable Performance Across Applications for Adhesive Preforms
Designed for a wide array of assembly tasks, the adhesive combines:
- Electrical Conductive Properties: With an impressively low volume resistivity of 0.00005 ohm-cm at 25°C, this film ensure maximum electrical conductivity (the highest I’ve ever seen on any bonding film), making it ideal for RF ground plane applications.
- Mechanical Strength: The film maintains structural integrity under demanding conditions, with a tensile lap shear strength of 1,100 psi on aluminum-to-aluminum bonds at 25°C.
- Thermal Conductivity: This film features THE highest thermal conductivity available for adhesive preform film in the market.
NASA-Approved Reliability
For applications that demand the utmost reliability, such as aerospace, LOCTITE® ABLESTIK ECF 3354 meets NASA outgassing standards. This ensures it can be trusted in environments where minimal contamination, and high performance are crucial. This material is listed in the MIL-STD-883 METHOD 5011, which is the gold standard for materials used for circuit boards- especially in bonding.
Key Features and Specifications
- Appearance: Grey
- Thickness: 4 mils (.004’’) (±0.5 mils)
- Cure Profile: 60 minutes at 150°C under 10 to 80 psi pressure, customizable to specific application needs
- Shelf Life: 3 months at 5°C, ensuring freshness and performance integrity
- Work Life: 7 days at 25°C for flexible handling
Streamlined Handling & Application of LOCTITE® ABLESTIK ECF 3354
To maximize the adhesive’s potential:
- Thawing: Allow the adhesive to reach room temperature (22°C) before opening to prevent moisture interference.
- Surface Preparation: Although cleaning is not mandatory, wiping substrates with isopropanol enhances adhesion.
- Pressure Application: Apply consistent pressure during curing with spring clamps, lamination presses, or vacuum bagging to ensure optimal wetting and bonding.
NEDC’s Expertise in Adhesive Preforms
At NEDC, we’re experts in cutting epoxy preforms to precise specifications, tailoring LOCTITE® ABLESTIK ECF 3354 to meet the unique demands of our clients. Our facility, and technical expertise allow us to provide custom solutions that enhance efficiency and performance for various industries, including electronics, aerospace, and telecommunications.
Why Choose NEDC for LOCTITE® ABLESTIK ECF 3354 Cutting?
We pride ourselves on offering the highest-performance thermal conductivity adhesive films available. Coupled with our dedication to quality and customer service, NEDC is your trusted partner in assembly and thermal management solutions. Whether you’re looking to optimize heat dissipation, improve structural integrity, or meet stringent industry standards, our team is here to deliver. NEDC is an expert in laser-cutting, and die-cutting adhesive bonding films.
More Information on LOCTITE ECF3354
With its unparalleled thermal conductivity, mechanical strength, and compliance with rigorous standards, it’s no wonder this product is a favorite among NEDC’s offerings. Trust us to provide not only the best products but also the expertise to ensure their optimal use in your applications. Contact NEDC today at sales@nedc.com to learn more about how LOCTITE® ABLESTIK ECF 3354 can transform your assembly processes and thermal management challenges!