LiPOLY’s DTT61-s is a thermal pad engineered specifically for single-phase immersion cooling environments, certified by Engineered Fluids for long-term resistance to dielectric coolant immersion. That certification is the key differentiator—most thermal pads on the market are not qualified for sustained submersion in engineered fluids, where coolant contamination and material breakdown can compromise both thermal performance and system integrity over time. The DTT61-s is formulated to prevent coolant contamination while maintaining its thermal conductivity characteristics throughout the immersion lifecycle, making it a purpose-built interface material for the growing class of liquid-immersed computing systems.
The DTT61-s belongs to LiPOLY’s Single-Phase Immersion Cooling series, a dedicated product family designed for submerged electronics applications. At 6.0 W/m·K per ASTM D5470, it provides solid thermal conductivity in a pad that is formulated to resist the chemical and physical stresses of continuous coolant exposure. The pad is naturally tacky on one or both sides, which simplifies assembly and keeps the material in position during the immersion process. Low thermal impedance and a range of available thicknesses round out a feature set tailored to immersion-cooled server, gaming PC, and AI PC architectures.
DTT61-s Specifications
The DTT61-s is a red thermal pad with a density of 3.3 g/cm³ and a thermal conductivity of 6.0 W/m·K per ASTM D5470. Its thermal impedance is rated at 0.387 °C-in²/W at 10 psi and 0.375 °C-in²/W at 20 psi, reflecting the modest improvement in interface contact that comes with increased mounting pressure. The pad operates across a wide temperature range of -60°C to 200°C, which covers the full envelope of single-phase immersion cooling operating conditions. Thickness is customized to the application per ASTM D374, and the material is available with surface tack on one or both sides (option 2) to accommodate different assembly workflows. Electrically, the DTT61-s offers a dielectric breakdown of 8 KV/mm per ASTM D149 and a surface resistivity greater than 10¹¹ Ohm per ASTM D257, providing robust electrical isolation between components and heat sinks or cold plates. The DTT61-s is fully ROHS and REACH compliant.
Typical properties:
- Thermal conductivity (ASTM D5470): 6.0 W/m·K
- Thermal impedance: 0.387 °C-in²/W @ 10 psi, 0.375 °C-in²/W @ 20 psi
- Color: Red
- Surface tack: 2-side / 1-side, option 2
- Thickness: Customized (ASTM D374)
- Density: 3.3 g/cm³ (ASTM D792)
- Application temperature: -60°C to 200°C
- Dielectric breakdown: 8 KV/mm (ASTM D149)
- Surface resistivity: >10¹¹ Ohm (ASTM D257)
- Compliance: ROHS & REACH compliant
- Configurations: Roll form, sheet form, die-cut parts
Download the DTT61-s datasheet here (LiPOLY product page).
Applications Where DTT61-s Excels
The DTT61-s is specified wherever thermal interface materials must survive continuous immersion in dielectric coolant while maintaining consistent thermal transfer between heat-generating components and cooling structures. Its certification by Engineered Fluids for long-term immersion resistance, combined with 6.0 W/m·K conductivity and low thermal impedance, makes it suited to the following applications:
- Single-phase immersion cooling of servers — thermal interface between processors, memory, and power delivery components submerged in dielectric fluid
- Gaming PC — high-performance thermal management for overclocked and compact gaming systems using immersion cooling
- AI PC — thermal interface for AI accelerator hardware in immersion-cooled compute platforms
- Solid State Drive (SSD) — heat dissipation from SSD controllers and NAND packages in submerged storage arrays
- Heat pipe assemblies — interface between heat pipes and heat-generating components in hybrid cooling architectures
- Memory modules — thermal transfer from DRAM and other memory devices to immersion fluid or cold plates
- Power amplifiers — heat dissipation from RF and baseband power amplifiers in immersion-cooled telecommunications hardware
Beyond its thermal performance, the DTT61-s functions as an effective electrical insulator. This dual role eliminates the need for a separate dielectric layer between live component surfaces and grounded cooling structures, simplifying assembly and reducing the number of materials in the thermal stack. The pad’s certification by Engineered Fluids for long-term immersion environment resistance is critical: in single-phase immersion cooling, the thermal interface material is in constant contact with dielectric coolant for the entire service life of the system. A pad that breaks down, leaches contaminants, or loses thermal conductivity in that environment can compromise the coolant chemistry and the thermal performance of the entire system. The DTT61-s is formulated to resist those failure modes while providing local isolation effects that offer an additional protective layer for electronic components, enhancing overall system stability.
DTT61-s and the LiPOLY Thermal Pad Lineup
The DTT61-s occupies a distinct position within LiPOLY’s thermal pad portfolio. Unlike the company’s Extreme Series pads—the T-work7000, T-work8000, and T-work9000—which are engineered for air-cooled applications at progressively higher conductivity tiers, the DTT61-s is built specifically for immersion cooling environments. While the Extreme Series tops out at 9.0 W/m·K with the T-work9000, the DTT61-s delivers 6.0 W/m·K in a material chemistry that can withstand continuous submersion in dielectric fluid without contaminating the coolant or degrading over time. For engineers designing immersion-cooled systems, the DTT61-s is the appropriate selection; for air-cooled or conduction-cooled applications, the Extreme Series pads remain the better fit. NEDC supplies the full LiPOLY range and can recommend the correct pad for a given cooling architecture.
Custom Die-Cut Supply Through NEDC
NEDC is an authorized converter of LiPOLY thermal products, including the DTT61-s and the full Single-Phase Immersion Cooling series. We supply the DTT61-s in custom die-cut parts to exact customer specifications, whether that means complex geometries for a specific component footprint, kiss-cut parts on a roll for high-volume assembly, or sheet form for in-house conversion. NEDC operates precision flatbed and rotary die-cutting equipment capable of holding tight tolerances on thermal pad materials. If you have a drawing, a CAD file, or even a sample part, we can produce the DTT61-s in the exact shape and thickness your application requires. The material is available in roll form, sheet form, and die-cut parts, and NEDC can apply tack to one or both sides as needed for the assembly process. NEDC can also assist with material selection across the LiPOLY range—if the DTT61-s is specified for an immersion application, we can help match the right thickness and configuration to your thermal budget.
For more information on the full range of thermal interface materials available, visit our thermal pads page.
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Need a custom DTT61-s die-cut part? Contact NEDC with your specifications.