When a standard commercial-grade pad cannot handle the thermal density of your power semiconductors, the next step in the CHO-THERM line delivers significantly more headroom. Parker Chomerics CHO-THERM T500 is a green silicone fiberglass pad that pushes thermal conductivity past the commercial ceiling while retaining the familiar handle and dielectric properties of the broader CHO-THERM family. At NEDC, we stock and convert T500 for customers upgrading from T441 or T609 who need better thermal management without changing their assembly processes.

CHO-THERM Thermal Pad Die-Cut Parts and Sheet Stock

Key Specifications

  • Material: Silicone with fiberglass reinforcement
  • Thickness: 0.010 in (0.25 mm) with plus or minus 0.002 in tolerance
  • Color: Green
  • Thermal Conductivity: 2.1 W per meter-Kelvin (ASTM D5470)
  • Thermal Impedance at 300 psi: 0.19 degrees C-inch squared per watt
  • Voltage Breakdown Dry: 2,500 Vac per mil (100 kVac per mm, ASTM D149)
  • Volume Resistivity Dry: 10 to the 14 power ohm-cm (ASTM D257)
  • Dielectric Constant at 1,000 kHz: 3.5 (ASTM D150)
  • Dissipation Factor at 1,000 kHz: 0.003
  • Tensile Strength: 3,000 psi (20.7 MPa, ASTM D412)
  • Tear Strength: 400 lb per in (70 kN/m, ASTM D642)
  • Elongation: 20 percent (ASTM D412)
  • Hardness: Shore A 80 (ASTM D2240)
  • Specific Gravity: 1.60 (ASTM D792)
  • Flammability: UL 94 V-0
  • Heat Capacity: 1 J per gram-degree C (ASTM E1269)
  • Coefficient of Thermal Expansion: 250 ppm per Kelvin (ASTM E831)
  • Operating Temperature: minus 76 to 392 degrees F (minus 60 to 200 degrees C)
  • Shelf Life: Indefinite (dry); 18 months (with PSA)
  • Outgassing: 0.40 percent TML, 0.10 percent CVCM (ASTM E595)

Where T500 Fits in the CHO-THERM Range

T500 sits in the high-performance tier alongside 1678 and 1671. Its 2.1 W per meter-Kelvin thermal conductivity makes it roughly twice as conductive as the commercial-grade T441 while keeping a similar Shore A hardness and fiberglass construction. The dielectric strength remains solid at 2,500 Vac per mil, which satisfies most power semiconductor assemblies. This is a direct upgrade path for engineers who want better thermal numbers without radically changing mounting pressures or package designs.

Typical Applications

  • Power semiconductors and switching devices
  • Motor and engine controllers in electric vehicles
  • UPS and power conversion modules
  • Television and consumer electronics where size is constrained but heat is high

NEDC converts T500 in custom die-cut configurations and roll stock. For the highest conductivity in the CHO-THERM line, see 1671. For standard commercial options, browse T441 or T609.

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