In demanding industries like aerospace, automotive, and electronics, adhesives need to do more than just stick. They must remain clean, low outgassing, fuel- and chemical-resistant, and integrate smoothly into high-volume production environments. That’s exactly where...
Die Cutting
GAP PAD TGP 7000ULM versus GAP PAD TGP 6000ULM | A Comparison
Henkel/Bergquist Gap Pad® 6000ULM vs. 7000ULM: Choosing the Right Thermal Interface Material When high-power electronics generate significant heat, choosing the right thermal interface material (TIM) is critical. Henkel/Bergquist’s Gap Pad® ULM series offers ultra-low...
501FL, and 502FL – Super Clean Lamination Adhesives by 3M – Lamination/Die Cut
When bonding applications demand not only strength but absolute cleanliness, not every adhesive is up to the task. 3M™ 501FL and 502FL adhesive transfer tapes stand out as go-to solutions for industries where even the smallest amount of contamination, adhesive ooze,...
Blog Post: 3M VHB Tape Max Series vs. Standard VHB Tape
Introduction The 3M VHB Tape Max Series marks a significant leap forward in high-performance bonding technology. Engineered as the toughest variant in the 3M VHB lineup, this series is optimized for the most demanding industrial applications. Let’s explore what makes...
Gap Pad 1500S30 | Custom Die Cutting Options (aka GAP PAD TGP 1300)
Introduction In the world of thermal management, the Gap Pad 1500S30, also known as Gap Pad TGP 1300, is a standout thermal interface material (TIM) engineered for demanding electronic applications. Trustworthy, conformable, and easy to use, it’s ideal for delicate...
TFLEX SF600 & SF800: Proven Thermal Gap Fillers — and Why New Designs Should Look to the SF4/7/10
Thermal gap fillers have become essential in modern electronics design, providing a reliable path for heat to move from hot components to cooling hardware. For years, Laird’s TFLEX SF600 and TFLEX SF800 have been widely used in applications where consistent...
Bridging the Heat with TGP 2000 (Gap Pad 2000S40) and NEDC’s Conversion Expertise
Thermal management is one of those hidden but absolutely critical challenges in electronics design. As devices get more powerful and compact, heat has fewer places to go. Without the right thermal interface material (TIM), systems risk overheating, performance...
Eccosorb BSR-1: Microwave Absorber Solutions
Introduction of Eccosorb BSR-1/MFS-124 Electromagnetic interference (EMI) is a persistent challenge in aerospace, telecom, and automotive electronics. One of the most proven solutions is Eccosorb BSR-1, a thin, flexible silicone absorber designed to suppress...
LOCTITE® ABLESTIK 5020K | Custom Die Cutting/Laser Cutting- In STOCK!
Film adhesive built to win against CTE mismatch When electronics see real-world thermal swings, coefficient of thermal expansion (CTE) mismatch is the silent killer of bonds. 5020K was engineered with that reality in mind. Its glass-supported epoxy film balances...
Die-Cutting Thermal Pads: Why It’s the Best Method
Why Laser Cutting Doesn’t Work Thermal gap pads—silicone, urethane, or hybrids—don’t cooperate with lasers: Silicone-based pads: The laser chars the material, leaving burnt, brittle edges that flake. Urethane or silicone-free pads: Even without silicone, these pads...
When Die Cutting Does (and Doesn’t) Work: Size, Thickness, and Practical Limits
Die cutting is a powerful process for making gaskets, foams, adhesives, and thermal pads at high speed. But like any manufacturing method, it has physical constraints. The interplay between material thickness, feature size, rule support, and kerf spacing determines...
Die Cutting 3M™ VHB™ Tape 4611: High-Temperature Bonding Solutions
In demanding environments where adhesives are exposed to heat, stress, and vibration, not every bonding solution holds up. That’s where 3M™ VHB™ Tape 4611 shines. As part of the VHB family, this tape delivers the strength and reliability engineers have come to expect,...
Navigating Our Blog: Your Guide to Die-Cutting, Gaskets, and Thermal Management
With over 100 blog posts, our site is a rich resource for engineers and designers. We've written on everything from specific material properties to the latest industry applications. Referencing these articles is a great way to deepen your understanding and find the...
The Role of Thermal Pads in 5G (and Future 6G) Communications
As 5G infrastructure continues to expand worldwide, the technology powering base stations, small cells, and data networks is becoming denser and more power hungry. Every generation of wireless communication pushes performance higher, but it also increases thermal...
Bergquist GAP PAD® 2500S20: ultra-conformable thermal gap filler for low-pressure assemblies
If you need a forgiving, fiberglass-reinforced pad that wets out beautifully at very low clamping forces, GAP PAD 2500S20 has been a go-to for years. It sits in the “S-Class” family (the soft, squishy stuff), pairing 2.4 W/m-K conductivity with Shore 00 ~20 softness...
THERM-A-GAP PAD 80: High-Performance 8.3 W/m-K Thermal Gap Filler
THERM-A-GAP PAD 80: High-Performance 8.3 W/m-K Thermal Gap Filler Managing heat in modern electronics has never been more critical. As devices shrink and power density rises, engineers require thermal interface materials (TIMs) that combine high thermal conductivity,...
TFLEX 300 Series: Legacy Gap Fillers and the New HD Alternatives
TFLEX 300 Series: Legacy Gap Fillers and the New HD Alternatives The TFLEX® 300 series has long been a trusted name in thermal interface materials (TIMs). Designed for reliable heat transfer and ease of integration, this family includes TFLEX 300, TFLEX 300H, and...
THERM-A-GAP PAD 30 | PAD30PN, PAD30A, PAD30G | Thermal Pad Cutting
THERM-A-GAP PAD 30 Series: Versatile Thermal Gap Fillers for High-Performance Electronics When it comes to managing heat in compact, high-power electronic designs, Parker Chomerics’ THERM-A-GAP PAD 30 series is a proven solution. With a thermal conductivity of 3.0...
TG-A3500 Thermal Gap Filler & TG-A3500F Thermal Gap Filler | Die-Cut
TG-A3500 & TG-A3500F: Ultra Soft Thermal Pads from T-Global Technology When it comes to managing heat in today’s high-performance electronics, designers turn to thermal interface materials (TIMs) that offer a reliable balance of conductivity, softness, and...
TG-A38KX Thermal Gap Filler by T-Global Technology | Custom Die Cutting
TG-A38KX by T-Global — High-Performance Thermal Pad for Demanding Applications Introduction: What Makes TG-A38KX Stand Out? The TG-A38KX from T-Global is a high-performance silicone-based thermal pad designed to deliver exceptional thermal interface performance in...
TG-A9000 Ultra Soft Thermal Pad from T-Global
The TG-A9000 Ultra Soft Thermal Pad from T-Global — Engineered for Next-Gen AI Hardware As artificial intelligence hardware becomes more powerful, the heat it generates becomes one of the biggest bottlenecks to performance. Data center GPUs, AI accelerators, and...
T-Putty™ 502: Closing the Thermal Gap in AI Hardware
T-Putty™ 502: Closing the Thermal Gap in AI Hardware AI workloads are driving unprecedented demand on hardware. Training and inference systems pack enormous compute power into ever-denser footprints, pushing GPUs, AI accelerators, and high-bandwidth memory (HBM) to...
Thermal Pad TFLEX B200 | A High Performing Reinforced Pad
Tflex B200: A Versatile Thermal Gap Filler for Modern Electronics When designing cutting-edge electronics—from EV battery packs to aerospace avionics and high-performance computing—managing heat effectively is mission-critical. That’s where Tflex B200 shines: a...
TFLEX HD300 versus TFLEX HD300TG | Soft Thermal Pads with Armor
Thermal Gap Fillers, Softness with Armor HD300 versus HD300TG HD300: Ultra-compliant 2.7 W/m·K gap filler for wide tolerances, low clamp loads, and high conformability. HD300TG: Same as HD300 core plus a Tgard™ fiberglass-reinforced silicone liner for...
TG-A6200 Thermal Gap Filler | High Performance Gap Filler
TG-A6200 versus TG-A6200LC Thermal Gap Filler In today’s high-performance electronics world—spanning AI, 5G, automotive, and medical tech—the efficient management of heat is critical. T-Global’s TG-A6200 and its enhanced counterpart TG-A6200LC are designed...
TFLEX HP34 | High Performance, Thermal Gap Filler | Die-Cut
Unveiling Tflex HP34: Next-Gen Thermal Gap Filler for Modern Electronics What Is Tflex HP34? Tflex HP34 is an advanced, silicone-free thermal gap filler developed by Laird Technologies. It features aligned graphite fibers, and boasts a remarkable bulk thermal...
Thermal Gap Filler TFLEX P300 | Polyimide Backed Gap Filler Pad
TFLEX™ P300: A Polyimide-Lined Gap Filler Built for Tough Thermal Challenges When it comes to managing heat in modern electronics, one size rarely fits all. From compact consumer devices to rugged aerospace modules, each design poses its own mechanical and thermal...
AI, GPU Performance & Thermal Pads: Why Heat Management Is More Critical Than Ever
In the race to dominate artificial intelligence, tech giants are building faster, more powerful GPUs that can process massive volumes of data in real time. Whether it's training large language models or performing inferencing tasks at the edge, these GPUs are pushing...
Thermal Gap Filler Pad TG-A1450 Ultra-Soft | High Performance Die Cut Pad
TG-A1450 Ultra Soft Thermal Pad: High Performance Where It Counts Most In today’s demanding thermal environments—where components run hotter, tighter, and more compact than ever—reliable thermal interface materials (TIMs) are mission-critical. The TG-A1450 Ultra Soft...
What Does Die Cut Mean? Unpacking the Term in Precision Manufacturing
When you encounter the term "die cut," it refers to a highly precise and efficient manufacturing action: the process of using a specialized tool called a steel rule die to create custom shapes. Imagine a cookie cutter, but on an industrial scale, applying enormous...
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Ultra-Thin Thermal Performance with Tflex™ UT20000- Custom Die Cut
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