If you need a forgiving, fiberglass-reinforced pad that wets out beautifully at very low clamping forces, GAP PAD 2500S20 has been a go-to for years. It sits in the “S-Class” family (the soft, squishy stuff), pairing 2.4 W/m-K conductivity with Shore 00 ~20 softness...
THERM-A-GAP PAD 80: High-Performance 8.3 W/m-K Thermal Gap Filler
THERM-A-GAP PAD 80: High-Performance 8.3 W/m-K Thermal Gap Filler Managing heat in modern electronics has never been more critical. As devices shrink and power density rises, engineers require thermal interface materials (TIMs) that combine high thermal conductivity,...
TFLEX 300 Series: Legacy Gap Fillers and the New HD Alternatives
TFLEX 300 Series: Legacy Gap Fillers and the New HD Alternatives The TFLEX® 300 series has long been a trusted name in thermal interface materials (TIMs). Designed for reliable heat transfer and ease of integration, this family includes TFLEX 300, TFLEX 300H, and...
THERM-A-GAP PAD 30 | PAD30PN, PAD30A, PAD30G | Thermal Pad Cutting
THERM-A-GAP PAD 30 Series: Versatile Thermal Gap Fillers for High-Performance Electronics When it comes to managing heat in compact, high-power electronic designs, Parker Chomerics’ THERM-A-GAP PAD 30 series is a proven solution. With a thermal conductivity of 3.0...
The Future of Thermal Management: How NEDC is Supporting Next-Gen AI
In this series, we've explored the foundational thermal challenges of AI hardware and the critical role of material selection and precision die-cutting in solving them. As the industry continues its rapid march toward more powerful, dense, and efficient computing, the...
Beyond the Pad: Die Cutting and Customization for AI Thermal Solutions
In our previous post, we dove into the key properties of thermal pads, such as thermal conductivity and compressibility, to help engineers select the right material. But the material itself is only half the solution. In the complex world of AI hardware, where space is...
The Thermal Problem: Why Your AI Hardware is Running on Borrowed Time
In the world of artificial intelligence and high-performance computing, speed is everything. But with great speed comes a significant challenge: heat. As AI hardware like GPUs (check out our post about finding the right thermal pad for your GPU) and specialized...
EVs(Electric Vehicles) & Thermal Pads
In February, I took possession of an electric vehicle. It got me thinking: electric vehicles use a lot of thermal interface materials—and not just in the car itself. Batteries are the lifeblood of electric vehicles. They control everything: propulsion, climate...
Silicone-Free Gap Pads | High Thermal Conductivity Pads
Nowadays, the world changes at an incredible pace. New electronics come out every day with potential to change the world. With all of these hot electronics, there is usually a requirement for a material to transfer the heat out of the application. Unfortunately, many...
3M Copper Foil Tapes | Custom Cut Shapes
At NEDC, we work with many materials that are used for EMI/RFI shielding, including gaskets, seals, and extrusions. While gaskets are our core product line, we also provide the value added benefit of converting 3M Copper Foil Tapes. 3M provides various different foil...
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Our Popular Blog Posts
CHO-THERM HV1110: Thinnest High-Voltage Thermal Insulator
When space inside an enclosure is limited and voltage across the...
CHO-THERM HV1717: Higher Conductivity in a Thin High-Voltage Pad
Engineers who need more thermal conductivity than the thinnest HV...






