Introduction If you’ve ever installed a gasket, foam pad, or adhesive-backed component, you know one of the most frustrating steps has nothing to do with performance—it’s peeling the liner. Liner removal can slow down assembly lines and cause operator aggravation....
3M™ 9690+ Double-Coated Tape – How NEDC Uses It in Industrial Gasketing and Assembly
Introduction of 3M 9690+ At NEDC, we convert and laminate a wide range of pressure-sensitive adhesives to support custom gaskets, seals, and industrial components. One of the most versatile adhesives we use is 3M™ 9690+, a double-coated acrylic tape designed for...
Gasketing for UL 48 Electric Signs/Electrical Signs: Getting the Details Right
Illuminated signs such as electronic billboards face long-term exposure to rain, sun, temperature swings, and vibration. UL 48, Standard for Electric Signs, sets the construction and safety requirements that make sure those signs stay reliable and safe for years. One...
GAP PAD TGP 7000ULM versus GAP PAD TGP 6000ULM | A Comparison
Henkel/Bergquist Gap Pad® 6000ULM vs. 7000ULM: Choosing the Right Thermal Interface Material When high-power electronics generate significant heat, choosing the right thermal interface material (TIM) is critical. Henkel/Bergquist’s Gap Pad® ULM series offers ultra-low...
Gap Pad 1500S30 | Custom Die Cutting Options (aka GAP PAD TGP 1300)
Introduction In the world of thermal management, the Gap Pad 1500S30, also known as Gap Pad TGP 1300, is a standout thermal interface material (TIM) engineered for demanding electronic applications. Trustworthy, conformable, and easy to use, it’s ideal for delicate...
Bridging the Heat with TGP 2000 (Gap Pad 2000S40) and NEDC’s Conversion Expertise
Thermal management is one of those hidden but absolutely critical challenges in electronics design. As devices get more powerful and compact, heat has fewer places to go. Without the right thermal interface material (TIM), systems risk overheating, performance...
Die-Cutting Thermal Pads: Why It’s the Best Method
Why Laser Cutting Doesn’t Work Thermal gap pads—silicone, urethane, or hybrids—don’t cooperate with lasers: Silicone-based pads: The laser chars the material, leaving burnt, brittle edges that flake. Urethane or silicone-free pads: Even without silicone, these pads...
Meet Our New AI Assistant: Your Smartest Way to Find Answers
We are excited to announce the launch of our new AI assistant, a powerful tool designed to help you quickly navigate our extensive resources. This chatbot is not just a simple Q&A bot; it's a specialized assistant trained on our entire library of blog posts,...
Bergquist GAP PAD® 2500S20: ultra-conformable thermal gap filler for low-pressure assemblies
Bergquist GAP PAD® 2500S20: ultra-conformable thermal gap filler for low-pressure assemblies If you need a forgiving, fiberglass-reinforced pad that wets out beautifully at very low clamping forces, GAP PAD 2500S20 has been a go-to for years. It sits in the “S-Class”...
THERM-A-GAP PAD 80: High-Performance 8.3 W/m-K Thermal Gap Filler
THERM-A-GAP PAD 80: High-Performance 8.3 W/m-K Thermal Gap Filler Managing heat in modern electronics has never been more critical. As devices shrink and power density rises, engineers require thermal interface materials (TIMs) that combine high thermal conductivity,...
TFLEX 300 Series: Legacy Gap Fillers and the New HD Alternatives
TFLEX 300 Series: Legacy Gap Fillers and the New HD Alternatives The TFLEX® 300 series has long been a trusted name in thermal interface materials (TIMs). Designed for reliable heat transfer and ease of integration, this family includes TFLEX 300, TFLEX 300H, and...
THERM-A-GAP PAD 30 | PAD30PN, PAD30A, PAD30G | Thermal Pad Cutting
THERM-A-GAP PAD 30 Series: Versatile Thermal Gap Fillers for High-Performance Electronics When it comes to managing heat in compact, high-power electronic designs, Parker Chomerics’ THERM-A-GAP PAD 30 series is a proven solution. With a thermal conductivity of 3.0...
The Future of Thermal Management: How NEDC is Supporting Next-Gen AI
In this series, we've explored the foundational thermal challenges of AI hardware and the critical role of material selection and precision die-cutting in solving them. As the industry continues its rapid march toward more powerful, dense, and efficient computing, the...
Beyond the Pad: Die Cutting and Customization for AI Thermal Solutions
In our previous post, we dove into the key properties of thermal pads, such as thermal conductivity and compressibility, to help engineers select the right material. But the material itself is only half the solution. In the complex world of AI hardware, where space is...
The Thermal Problem: Why Your AI Hardware is Running on Borrowed Time
In the world of artificial intelligence and high-performance computing, speed is everything. But with great speed comes a significant challenge: heat. As AI hardware like GPUs (check out our post about finding the right thermal pad for your GPU) and specialized...
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T-Global TG-A1660 Ultra Soft Thermal Pad | High Thermal Conductivity Pad
When it comes to managing heat in today’s high-power electronics,...
Die-Cut 3M™ VHB™ RP-Series Tapes — Bonding Solutions from NEDC
The Better Way to Bond 3M™ VHB™ Tape eliminates screws, welds, and...





