Heat is one of the biggest threats to electronics reliability. Even tiny surface irregularities create air pockets that block heat flow from power devices, LEDs, or processors to a heat sink. THERM-A-GAP PAD 10 solves this problem by providing a soft, silicone-based, thermally conductive bridge — while its siblings PAD 10A and PAD 10G add assembly options for production and large-format builds.
The PAD 10 Family — Quick Overview
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PAD 10 — ultra-soft, highly conformable gap filler.
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PAD 10A — same base material with an aluminum foil carrier and optional PSA backing for peel-and-stick placement and rugged handling.
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PAD 10G — reinforced with glass fiber to improve shape stability and ease of handling, especially in thin or large cuts.
All three are available in a thickness range from 0.010” up to 0.200”, so you can match pad height to the exact mechanical gap in your assembly.
Typical thermal conductivity is about 1.0 W/m·K, and the material’s durometer is around 35 Shore 00 — meaning it’s exceptionally soft and easily compresses to fill uneven surfaces.
Why Engineers Like These Pads
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Wide operating window — stable from –67 °F to 392 °F (–55 °C to 200 °C).
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Electrical insulation built in — high dielectric strength and low dissipation factor make it safe around live circuits.
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Fire and environmental compliance — UL 94 V-0 flammability rating and RoHS compliance.
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Low outgassing — ideal for sealed or sensitive environments. (.44% TML , and .01% CVCM)
PAD 10 products are also easy to die cut or waterjet cut into complex shapes, so prototypes and production parts can be tailored to your assembly.
When to Pick Each Variant
| Variant | Carrier / Adhesive | Ideal Use |
|---|---|---|
| PAD 10 | None | Maximum softness, uneven surfaces, prototypes |
| PAD 10A | Aluminum + optional PSA | Fast placement in production, added tear resistance |
| PAD 10G | Glass fiber | Large pieces or thin profiles that need dimensional stability |
Application Examples
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LED lighting: fill between boards and housings without stressing solder joints.
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Automotive ECUs: absorb vibration while maintaining thermal transfer.
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Consumer devices: smartphones, laptops, small modules where gentle compression is key.
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Telecom gear: large, multi-component boards needing easy, repeatable assembly.
Integration Tips
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Choose the thinnest pad that still bridges the gap to keep thermal resistance low.
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Use uniform compression — avoid pinch points or uneven clamping.
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Clean mating surfaces before placement.
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Consider PAD 10A if you want PSA to hold pads during high-volume builds.
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Pick PAD 10G if your parts are big or thin and prone to stretching.
Final Takeaway
The THERM-A-GAP PAD 10 line hits the sweet spot for moderate heat loads where easy assembly and mechanical safety matter. Choose PAD 10 for maximum softness, PAD 10A for adhesive-backed production builds, and PAD 10G for stable, large or thin parts — all available in thicknesses from .010” to .200” to fit your design needs.