Henkel/Bergquist Gap Pad® 6000ULM vs. 7000ULM: Choosing the Right Thermal Interface Material When high-power electronics generate significant heat, choosing the right thermal interface material (TIM) is critical. Henkel/Bergquist’s Gap Pad® ULM series offers ultra-low...
Posts Written by: Garrett Abare
501FL, and 502FL – Super Clean Lamination Adhesives by 3M – Lamination/Die Cut
When bonding applications demand not only strength but absolute cleanliness, not every adhesive is up to the task. 3M™ 501FL and 502FL adhesive transfer tapes stand out as go-to solutions for industries where even the smallest amount of contamination, adhesive ooze,...
Blog Post: 3M VHB Tape Max Series vs. Standard VHB Tape
Introduction The 3M VHB Tape Max Series marks a significant leap forward in high-performance bonding technology. Engineered as the toughest variant in the 3M VHB lineup, this series is optimized for the most demanding industrial applications. Let’s explore what makes...
Gap Pad 1500S30 | Custom Die Cutting Options (aka GAP PAD TGP 1300)
Introduction In the world of thermal management, the Gap Pad 1500S30, also known as Gap Pad TGP 1300, is a standout thermal interface material (TIM) engineered for demanding electronic applications. Trustworthy, conformable, and easy to use, it’s ideal for delicate...
Why Silicone-Free Thermal Pads Aren’t Exclusively Used
When it comes to thermal interface materials (TIMs), silicone-free thermal pads have grown in popularity. They address some of the pain points engineers and assemblers encounter with silicone-based products, especially in sensitive applications. But despite their...
The Importance of Kiss-Cut Thermal Pad Kits in Electronics Assembly
Thermal interface materials (TIMs) are essential for keeping electronics cool and reliable. But anyone who’s ever worked on a build knows that getting pads into the right spot — especially when there are dozens of shapes and sizes — can be tedious, error-prone, and...
TFLEX SF600 & SF800: Proven Thermal Gap Fillers — and Why New Designs Should Look to the SF4/7/10
Thermal gap fillers have become essential in modern electronics design, providing a reliable path for heat to move from hot components to cooling hardware. For years, Laird’s TFLEX SF600 and TFLEX SF800 have been widely used in applications where consistent...
Bridging the Heat with TGP 2000 (Gap Pad 2000S40) and NEDC’s Conversion Expertise
Thermal management is one of those hidden but absolutely critical challenges in electronics design. As devices get more powerful and compact, heat has fewer places to go. Without the right thermal interface material (TIM), systems risk overheating, performance...
Tflex™ 50000: High-Performance Thermal Gap Filler
Introduction Managing heat in electronics is one of the toughest challenges engineers face. As devices get smaller and more powerful, thermal performance becomes critical. Tflex™ 50000, a gap filler from Laird, is designed to efficiently conduct heat while protecting...
Eccosorb BSR-1: Microwave Absorber Solutions
Introduction of Eccosorb BSR-1/MFS-124 Electromagnetic interference (EMI) is a persistent challenge in aerospace, telecom, and automotive electronics. One of the most proven solutions is Eccosorb BSR-1, a thin, flexible silicone absorber designed to suppress...
MIL-STD-883: The Reliability Standard for Adhesive Films
When electronics go into orbit, into a fighter jet, or onto a satellite, the adhesive layer holding a die or substrate in place is just as critical as the silicon itself. MIL-STD-883 is the U.S. Department of Defense’s benchmark for microcircuit reliability, and it’s...
LOCTITE® ABLESTIK 5020K | Custom Die Cutting/Laser Cutting- In STOCK!
Film adhesive built to win against CTE mismatch When electronics see real-world thermal swings, coefficient of thermal expansion (CTE) mismatch is the silent killer of bonds. 5020K was engineered with that reality in mind. Its glass-supported epoxy film balances...
RS-800 Series Silicone Sponge: A Direct Alternative to HT-800, HT-820, HT-840, HT-870
Introduction For decades, Rogers’ HT-800 series silicone foams have been the benchmark for lightweight, durable gasketing materials. But what if you need a silicone sponge alternative with comparable compression, sealing, and thermal stability? Enter the RS-800...
Rogers BISCO® Silicone Sponge: RS-720, RS-750, and RS-770
When it comes to gasketing materials, silicone-based products offer a combination of temperature resistance, long-term durability, and reliable sealing performance. Within the Rogers BISCO® product family, the RS series of cellular silicones—RS-720, RS-750, and...
FOD Gaskets; Gaskets to Prevent FOD: Silicone Rubber, Poron®, Silicone Foam, and Silicone Sponge
In industries where reliability and cleanliness are paramount—such as aerospace, defense, electronics, and medical devices—the risk of foreign object debris (FOD) is never taken lightly. A single loose particle, shaving, or improperly selected material can jeopardize...
Compression Rates in Rubber Gaskets : Solid vs. Foam/Sponge for Air & Water Sealing
Why Compression Rate Matters When designing with gaskets, compression isn’t just about fit—it directly determines sealing performance, stress relaxation, and gasket life. Compress too little, and you get leaks; compress too much, and you risk tearing or losing...
Die-Cutting Thermal Pads: Why It’s the Best Method
Why Laser Cutting Doesn’t Work Thermal gap pads—silicone, urethane, or hybrids—don’t cooperate with lasers: Silicone-based pads: The laser chars the material, leaving burnt, brittle edges that flake. Urethane or silicone-free pads: Even without silicone, these pads...
When Die Cutting Does (and Doesn’t) Work: Size, Thickness, and Practical Limits
Die cutting is a powerful process for making gaskets, foams, adhesives, and thermal pads at high speed. But like any manufacturing method, it has physical constraints. The interplay between material thickness, feature size, rule support, and kerf spacing determines...
3M VHB 5980 Tape: Technical Bonding for Touch Panels, Bezels, and Electronics
A few years back, we wrote about the 3M VHB 5906, 5907, and 5908 tapes—all versatile thin VHB foams widely adopted for electronics and assembly. Today, we’re focusing on another important product in the lineup: 3M VHB 5980 tape, which has become a trusted bonding...
ThermaCool® Thermal Interface Products: Technical Overview & Application Mapping
Why ThermaCool® As power density climbs, thermal interfaces must bridge variable gaps, tolerate low clamp forces, and remain electrically insulating. Saint-Gobain’s ThermaCool® portfolio spans soft gap fillers, thermally conductive tapes, coated fabrics, and specialty...
ThermaCool® TC100U Thermal Pad from Saint-Gobain
Overview: What Is ThermaCool TC100U? ThermaCool TC100U is an uncured (B-Stage) by Saint Gobain unsupported thermally conductive silicone rubber sheet designed as both a gap filler and thermal interface. Unlike traditional pre-cured pads, TC100U bonds in place during...
Gaskets in Medical Devices: Silicone Rubber, Expanded PTFE, and Viton®
Introduction In medical devices, gaskets are far more than sealing elements—they are critical components that ensure biocompatibility, sterility, chemical resistance, and functional reliability in some of the most demanding environments. Whether in surgical...
THERM-A-GAP™ PAD 70TP Family (70TP / 70TPA / 70TPG / 70TPF): Selection, and Applications
Parker Chomerics’ THERM-A-GAP PAD 70TP family is a 7.0 W/m-K, ultra-soft “thermal putty” sheet system offered with four structural options: unsupported (70TP), aluminum-foil/PSA (70TPA), woven-glass offset carrier (70TPG), and woven-glass centered carrier (70TPF). The...
Die Cutting 3M™ VHB™ Tape 4611: High-Temperature Bonding Solutions
In demanding environments where adhesives are exposed to heat, stress, and vibration, not every bonding solution holds up. That’s where 3M™ VHB™ Tape 4611 shines. As part of the VHB family, this tape delivers the strength and reliability engineers have come to expect,...
Thermal Gap Filler Pad Carriers: A Complete Guide to Films, Fabrics, and Reinforced Options
Thermal gap filler pads are more than just silicone sheets. Inside many of them are carriers—thin films, fabrics, or reinforced layers that determine how a pad handles, compresses, insulates, and transfers heat. Understanding carriers helps you select the right pad...
The Role of Thermal Pads in 5G (and Future 6G) Communications
As 5G infrastructure continues to expand worldwide, the technology powering base stations, small cells, and data networks is becoming denser and more power hungry. Every generation of wireless communication pushes performance higher, but it also increases thermal...
The Importance of Repositionable and Reusable Gap Pads in Thermal Management
In high-performance electronics, thermal interface materials (TIMs) are the unsung heroes that allow heat to flow from hot components into heat spreaders, chassis, or heat sinks. Among these, gap pads have become essential for bridging uneven surfaces and filling air...
Laird’s Low-Dielectric RF Absorbers: Breaking New Ground in RF Design
Introduction Managing radio frequency (RF) interference and internal reflections remains a crucial challenge for modern electronics. Whether it's aerospace, defense, 5G infrastructure, or IoT systems, ensuring signal integrity and mitigating interference often hinges...
The Role of Thermal Pads in Modern Game Consoles
When it comes to modern gaming consoles, thermal management is just as important as GPU horsepower or SSD speed. Inside a PlayStation, Xbox, or handheld device, a surprising amount of engineering goes into making sure components stay cool during marathon gaming...
THERM-A-GAP™ PAD 80LO: High-Performance Gap Filler Pad for Critical Electronics
As semiconductor power density continues to climb, thermal interface materials must deliver both high conductivity and long-term reliability. Parker Chomerics THERM-A-GAP™ PAD 80LO is engineered specifically for these demands: a high-performance, low-oil-bleed,...
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