In the race to dominate artificial intelligence, tech giants are building faster, more powerful GPUs that can process massive volumes of data in real time. Whether it’s training large language models or performing inferencing tasks at the edge, these GPUs are pushing the limits of performance — and with that comes a new frontier of thermal challenges.
As a manufacturer of high-performance thermal pads, we see firsthand how the world’s appetite for faster, smarter computing has created a parallel need: managing the heat that comes with it.
Why GPUs Are Running Hotter Than Ever
AI workloads are incredibly compute-intensive. GPUs used in AI training — like those from NVIDIA, AMD, and even custom silicon from cloud providers — run long-duration, high-power tasks. Add in higher clock speeds, denser chiplet architectures, and stacked memory, and you’ve got a perfect storm for thermal strain.
Every year, we see hardware specs inching higher:
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Clock speeds that exceed 2.5–3.0 GHz
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Power draw north of 500W per chip
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Densely packed boards with little airflow
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AI accelerators with zero tolerance for throttling
This results in one inevitable output: heat. Lots of it. Let me tell you something. Picture turning your oven on to broil mode, but then copying your oven a hundred times all on broil mode. You are now in the heat of a datacenter.
Why Heat Is the Silent Performance Killer
Thermal issues don’t always announce themselves with a bang — but they quietly steal performance. Heat causes:
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Thermal throttling: Clock speeds get reduced to prevent damage
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Reduced efficiency: Systems draw more power per operation
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Shorter lifespan: Heat degrades silicon over time
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Mechanical failures: Warping, cracking, or delamination of components
The end result? Underperforming hardware and failed deployments. That’s why high-performance thermal interface materials (TIMs) — especially conformable, high-conductivity thermal pads — are no longer optional. They’re essential.
The Role of Thermal Pads in the AI Era
A quality thermal pad serves one critical job: move heat away from components and into a heatsink as fast and efficiently as possible.
At our company, we manufacture thermal pads that are:
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Highly conformable, filling microscopic surface gaps
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High conductivity (up to 6 W/m·K and beyond)
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Reliable over time, even under pressure cycling and thermal expansion
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Available in custom shapes, ideal for multi-chip modules (MCMs), VRMs, and memory arrays
In AI hardware, where power density is rising, even a small decrease in thermal resistance can mean a higher sustained clock speed and longer life for critical components. NEDC supports a number of manufacturers including Bergquist/Henkel, Laird/DuPont, FujiPoly, T-Global Technology, and Chomerics.
Why NEDC makes the Difference Here?
NEDC supports all these thermal pad providers. However, in this case there are plenty of thermal pad providers that have higher W/m-K, or better thermal transfer. NEDC has many different types of thermal pads that can be used for all different types of applications. NEDC is a good partner to get these pads through die-cutting.
What to Look for in a Thermal Pad for AI/ML GPUs
If you’re designing or sourcing hardware for AI acceleration, here are key features your thermal pad must have:
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Ultra-low thermal impedance: Not just high conductivity, but effective transfer across the full surface
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Softness and compliance: Especially for uneven or large chip arrays
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Stability under pressure: No flow, no pump-out, no drying
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Repeatable manufacturing: Custom die-cut options for mass production
The Bottom Line for GPUs/Thermal Pads
AI is the future — but heat is the price of progress. The smarter the chip, the hotter it runs. And the better your thermal interface solution, the more performance you can unlock. As a leading thermal pad manufacturer, we’re not just keeping up with the AI revolution — we’re enabling it. If you’re working on next-gen GPU systems or AI hardware and need help specifying the right pad, our engineering team is here to help. For more information, please contact sales@nedc.com.