Bonding Capabilites

When making bonded frames or "O" Rings, New England Die Cutting/American EMI Solutions is capable of cold bonding or vulcanizing of EMI Shielding materials to meet your needs. Cold Bonding is a less expensive method that is used for larger quantities and utilizes an RTV material for the bonding process. The vulcanizing process uses the same material compound that is utilized in the molding or extruding of the parent material of the gasket. The compound is heated and forms a complete bond of the two adjoining surfaces. This method is slightly more expensive than the cold bond method but does supply a more consistent bond and eliminates any EMI leakage in the bonded area.